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PIC32MX270F256DT-50I/PT

Microchip Technology

PIC32MX270F256DT-50I/PT by Microchip Technology

PIC32MX270F256DT-50I/PT by Microchip: 32-bit RISC CPU, 262144 ROM words, 65536 RAM bytes. Ideal for industrial applications with peripherals like BOR, PWM, and RTC. Offers low power mode and operates at up to 50 MHz clock frequency.

Median Price

$6.120

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$6.120

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10

$6.120

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Vyrian

USA . 6,649 parts In-Stock

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6,649

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$5.998

100+ parts

-

1k+ parts

$5.758

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1,000

$5.998

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$5.758

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Continental Prestige Electronics

USA . 6,094 parts In-Stock

1+ parts

$6.120

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$5.998

6,094

$6.120

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$5.998

Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$6.243

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$6.243

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$6.243

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$6.243

$6.243

$6.243

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AZTECH Wire

Italy . 828 parts In-Stock

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$13.807

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828

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Aztec Data Supply Inc.

USA . 2,282 parts In-Stock

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$20.880

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$20.880

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Ampacity Inc.

Singapore . 1,168 parts In-Stock

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$27.000

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Corohmni

South Africa . 1,070 parts In-Stock

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$27.568

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Semicontronic

India . 1,281 parts In-Stock

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$32.000

100+ parts

$31.200

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$31.040

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1,281

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$31.040

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XL Components Corporation

Australia . 4,308 parts In-Stock

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Argo Parts USA

USA . 3,162 parts In-Stock

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Marpe Global Electronics

Taiwan . 2,366 parts In-Stock

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QualityLine Systems

Poland . 291 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the PIC32MX270F256DT-50I/PT microcontroller by Microchip Technology. Known for their superior quality and reliability, Microchip Technology offers cutting-edge solutions for a wide range of applications in the microcontroller category. With advanced features like multiple ADC channels, DMA support, and low power mode, this product provides unmatched value and benefits to customers looking to optimize their designs. Trust in Microchip Technology to deliver innovative solutions that meet your technical requirements and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers due to its lightweight and cost-effective nature.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a range of voltage sources.

Minimum Operating Temperature: -40 °C

Can withstand harsh operating conditions in industrial environments with low temperatures.

ADC Channels: YES

Integrated analog-to-digital converters provide the ability to interface with analog sensors and signals.

Peripherals: BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT

A wide range of peripherals available for various functions and tasks, enhancing the versatility of the microcontroller.

Analog To Digital Convertors: 13-Ch 10-Bit

Multiple high-resolution ADC channels enable precise analog signal conversion for accurate data acquisition.

Connectivity: I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Support for multiple communication protocols ensures compatibility with a variety of devices and systems.

Technical Specifications

Microcontrollers PIC32MX270F256DT-50I/PT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

33

No. of Serial I/Os:

4

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP44,.39SQ,31

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

13-Ch 10-Bit

Trade Compliance

PIC32MX270F256DT-50I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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