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PIC32MX270F256D-V/TL

Microchip Technology

PIC32MX270F256D-V/TL by Microchip Technology

PIC32MX270F256D-V/TL by Microchip: 32-bit microcontroller with 262144 ROM words, 65536 RAM bytes, and 13-Ch 10-Bit ADC channels. Ideal for industrial applications requiring a max clock frequency of 40 MHz, featuring peripherals like USB, PWM, and RTC.

Median Price

$7.254

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$7.254

100+ parts

-

1k+ parts

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650

$7.254

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Vyrian

USA . 5,311 parts In-Stock

1+ parts

-

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5,311

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,977 parts In-Stock

1+ parts

$7.254

100+ parts

-

1k+ parts

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10k+ parts

$7.109

6,977

$7.254

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-

$7.109

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$7.399

100+ parts

$7.399

1k+ parts

$7.399

10k+ parts

-

1,000

$7.399

$7.399

$7.399

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Ampacity Inc.

Singapore . 1,347 parts In-Stock

1+ parts

$14.000

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1,347

$14.000

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Semicontronic

India . 187 parts In-Stock

1+ parts

$16.000

100+ parts

$15.600

1k+ parts

$15.520

10k+ parts

-

187

$16.000

$15.600

$15.520

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AZTECH Wire

Italy . 817 parts In-Stock

1+ parts

$18.306

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817

$18.306

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Corohmni

South Africa . 142 parts In-Stock

1+ parts

$47.402

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142

$47.402

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Aztec Data Supply Inc.

USA . 76 parts In-Stock

1+ parts

$82.710

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76

$82.710

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Lixinc

USA . 6,408 parts In-Stock

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6,408

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,576 parts In-Stock

1+ parts

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4,576

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$7.109

1k+ parts

$6.892

10k+ parts

$6.747

2,000

-

$7.109

$6.892

$6.747

Fulton Briggs Corp.

USA . 1,467 parts In-Stock

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1,467

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Microchip USA

USA . 316 parts In-Stock

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316

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Overview

Unleash the power of innovation with the Microchip Technology PIC32MX270F256D-V/TL microcontroller. Designed for excellence, this cutting-edge device offers unparalleled quality and reliability, setting the industry standard for microcontrollers. With a wide range of applications in various industries, this product delivers exceptional value by providing advanced features and functionalities. Experience seamless connectivity, superior performance, and endless possibilities with the PIC32MX270F256D-V/TL. Elevate your projects to new heights with Microchip Technology.

Feature Benefit Bullets

Surface Mount: YES

Enables easy and convenient mounting on PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltage compatibility, providing flexibility in power supply options.

Screening Level: TS 16949

Indicates adherence to high-quality automotive industry standards, ensuring reliability and performance in critical applications.

Package Shape: SQUARE

Square package shape helps in optimizing space on the PCB and facilitates efficient layout design.

Bit Size: 32

32-bit architecture provides high computational capability and performance for handling complex tasks efficiently.

No. of Terminals: 44

A higher number of terminals offer greater connectivity options and flexibility for interfacing with external peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures efficient heat dissipation, compact form factor, and ease of integration in space-constrained applications.

Minimum Supply Voltage: 2.3 V

Low minimum supply voltage allows for operation in energy-efficient and battery-powered applications.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance makes the microcontroller suitable for harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range capability ensures operation in extreme cold conditions, enhancing the microcontroller's versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance, conductivity, and solderability, enhancing the longevity and reliability of the connections.

ADC Channels: YES

Integrated Analog to Digital Converters enable accurate conversion of analog signals, expanding the range of sensor interfaces and data acquisition capabilities.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency and reduce CPU workload, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, optimizing signal integrity and reducing interference.

ROM Words: 262144

Large ROM capacity allows for storing a significant amount of program data, enabling complex applications and algorithms to be implemented.

Maximum Seated Height: 1 mm

Low profile design with maximum seated height of 1 mm ensures space-saving installation in compact devices.

Width: 6 mm

Compact 6 mm width enables integration in slim form factor applications without compromising functionality.

Peripherals: BOR, COMPARATOR(3), DMA(6), POR, PWM, RTC, TIMER(5), USB, WDT

A rich set of peripherals including timers, PWM, USB, and watchdog timer enhances the microcontroller's functionality and versatility for diverse applications.

Maximum Clock Frequency: 40 MHz

High clock frequency capability of 40 MHz ensures quick operation and efficient processing of data and instructions.

Length: 6 mm

Short 6 mm length facilitates space-efficient board layout and integration in constrained spaces.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in demanding environments, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient data processing, reduced power consumption, and faster execution, making it suitable for real-time applications.

RAM Bytes: 65536

Ample RAM capacity of 65536 bytes enables efficient data storage and manipulation, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and fast switching speeds, enhancing the microcontroller's efficiency.

Terminal Form: BUTT

Butt terminal form facilitates easy soldering and reliable electrical connections, ensuring robust performance in varied operating conditions.

Analog To Digital Convertors: 13-Ch 10-Bit

13-channel 10-bit ADC configuration enables precise conversion of analog signals into digital data, enhancing sensor integration and signal processing capabilities.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage of 3.3 V ensures compatibility with common power sources and simplifies system design.

PWM Channels: YES

Pulse Width Modulation channels allow for precise control of analog outputs, enabling applications such as motor control and LED dimming.

Connectivity: I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Multiple connectivity options including UART, SPI, I2C, and I2S enable seamless communication with peripheral devices and interfaces, enhancing system versatility.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility for in-system programming and firmware updates, simplifying maintenance and enhancing product longevity.

Terminal Pitch: 0.5 mm

Close terminal pitch of 0.5 mm facilitates high-density mounting, enabling compact PCB design and space optimization.

Speed: 40 rpm

Operating speed of 40 rpm ensures quick response times and efficient execution of instructions, enhancing system performance.

On Chip Program ROM Width: 8

8-bit on-chip program ROM width facilitates efficient data processing and program execution, supporting a wide range of applications.

No. of I/O Lines: 33

33 I/O lines offer sufficient flexibility and input/output options for interfacing with external devices and peripherals, making it versatile for various applications.

Technical Specifications

Microcontrollers PIC32MX270F256D-V/TL attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

AEC-Q100 PLANNED, THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XBCC-B44

JESD-609 Code:

e4

Length:

6 mm

No. of I/O Lines:

33

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(6), POR, PWM, RTC, TIMER(5), USB, WDT

Analog To Digital Convertors:

13-Ch 10-Bit

Trade Compliance

PIC32MX270F256D-V/TL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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