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PIC32MX270F256BT-V/ML

Microchip Technology

PIC32MX270F256BT-V/ML by Microchip Technology

PIC32MX270F256BT-V/ML by Microchip: 32-bit RISC microcontroller with 262144 ROM words, 65536 RAM bytes, and 9-Ch 10-Bit ADC channels. Ideal for industrial applications requiring a max clock frequency of 40 MHz, low power mode support, and connectivity via I2C, SPI, UART interfaces.

Median Price

$6.440

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 99 parts In-Stock

1+ parts

$6.440

100+ parts

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99

$6.440

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Vyrian

USA . 2,601 parts In-Stock

1+ parts

-

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2,601

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,727 parts In-Stock

1+ parts

$6.440

100+ parts

-

1k+ parts

-

10k+ parts

$6.311

4,727

$6.440

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-

$6.311

Netroflash

USA . 50 parts In-Stock

1+ parts

$6.440

100+ parts

-

1k+ parts

$6.118

10k+ parts

$5.989

50

$6.440

-

$6.118

$5.989

AZTECH Wire

Italy . 604 parts In-Stock

1+ parts

$6.878

100+ parts

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604

$6.878

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Ampacity Inc.

Singapore . 882 parts In-Stock

1+ parts

$27.000

100+ parts

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882

$27.000

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Argo Parts USA

USA . 2,211 parts In-Stock

1+ parts

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2,211

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West Coast Incorporated

USA . 2,152 parts In-Stock

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2,152

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Overview

Unleash the power of cutting-edge technology with the PIC32MX270F256BT-V/ML microcontroller from Microchip Technology. Designed for industrial-grade applications, this RISC-based microcontroller offers unparalleled performance and reliability. With a wide range of peripherals including PWM, RTC, and DMA channels, this chip is perfect for projects requiring precision and efficiency. Trust in Microchip's proven track record of quality and innovation to take your designs to the next level. Experience the seamless integration and exceptional value that the PIC32MX270F256BT-V/ML brings to your development process.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this product is compatible with a wide range of power sources, offering flexibility in design.

On Chip Data RAM Width: 8

The 8-bit data RAM width ensures efficient data handling and processing capabilities, making the product suitable for high-speed applications.

Screening Level: TS 16949

Compliant with TS 16949 screening level standards, this product ensures high quality and reliability in automotive applications.

Package Shape: SQUARE

The square package shape allows for space-saving and efficient PCB layout, making it a practical choice for compact designs.

Bit Size: 32

With a 32-bit architecture, this product offers enhanced computational power and performance, suitable for demanding tasks.

No. of Terminals: 28

Featuring 28 terminals, this product provides sufficient I/O options for connecting external devices, enhancing versatility in applications.

Package Style: CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

The chip carrier style with a thin profile and heat sink/slug design ensures efficient heat dissipation and compact form factor, suitable for space-constrained environments.

Minimum Supply Voltage: 2.3 V

With a low minimum supply voltage of 2.3V, this product is energy-efficient and can operate in low-power scenarios, extending battery life.

Technical Specifications

Microcontrollers PIC32MX270F256BT-V/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

AEC-Q100 PLANNED, THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

19

No. of Serial I/Os:

4

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

9-Ch 10-Bit

Trade Compliance

PIC32MX270F256BT-V/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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