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PIC32MX270F256B-I/ML

Microchip Technology

PIC32MX270F256B-I/ML by Microchip Technology

PIC32MX270F256B-I/ML by Microchip: 32-bit RISC CPU, 50 MHz clock, 65536 RAM bytes. Ideal for industrial applications requiring low power mode, with peripherals like USB, PWM, and RTC for enhanced connectivity and control.

Median Price

$5.000

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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RS (Exports)

UK . 15 parts In-Stock

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$1.240

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RS Americas

USA . 15 parts In-Stock

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$3.000

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DigiKey

USA . 183 parts In-Stock

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$5.260

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$4.380

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$4.380

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Mouser Electronics

USA . 108 parts In-Stock

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$5.260

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$4.380

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Microchip Technology

USA . 61 parts In-Stock

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$5.260

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$4.380

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$4.020

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$3.810

61

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$4.020

$3.810

Future Electronics

Canada . 4,353 parts In-Stock

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$4.740

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$4.640

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Master Electronics

USA . 285 parts In-Stock

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$4.540

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$4.250

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Verical

USA . 285 parts In-Stock

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$5.341

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$5.341

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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$5.488

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Chip Stock

USA . 18,500 parts In-Stock

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IBS Electronics

USA . 4,638 parts In-Stock

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$6.367

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$5.876

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Vyrian

USA . 3,863 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 116 parts In-Stock

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$2.550

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Semicontronic

India . 116 parts In-Stock

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$2.550

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$2.486

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$2.474

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$2.550

$2.486

$2.474

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Continental Prestige Electronics

USA . 1,888 parts In-Stock

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$5.020

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$4.920

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$4.920

Netroflash

USA . 500 parts In-Stock

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$5.488

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Allen Electronics Distributors

USA . 15 parts In-Stock

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$7.980

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$5.880

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AZTECH Wire

Italy . 379 parts In-Stock

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$13.241

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Corohmni

South Africa . 360 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,210 parts In-Stock

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$66.940

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Advanced Electronics

New Zealand . 68 parts In-Stock

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$78.680

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$74.746

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Lixinc

USA . 15,416 parts In-Stock

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LOOK Integrated Logistics

Peru . 5,858 parts In-Stock

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Argo Parts USA

USA . 4,573 parts In-Stock

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LMD Electronica

Estonia . 3,330 parts In-Stock

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NIA Electronics

USA . 2,409 parts In-Stock

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Ledger Components

France . 2,409 parts In-Stock

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Montano Global Distributors

Canada . 2,290 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,719 parts In-Stock

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Overview

Unlock the power of innovation with the Microchip Technology PIC32MX270F256B-I/ML microcontroller. Designed by a trusted industry leader, this versatile chip offers endless possibilities for your next project. With advanced features like high-speed processing, multiple peripherals, and low power modes, this microcontroller is perfect for a wide range of applications. Whether you're working on robotics, IoT devices, or consumer electronics, the PIC32MX270F256B-I/ML delivers exceptional performance and reliability. Experience the quality and value Microchip Technology brings to every design challenge.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protects the microcontroller from external elements, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of voltage sources.

Bit Size: 32

32-bit architecture enables high processing power and performance for complex tasks and calculations.

ADC Channels: YES

Built-in Analog to Digital Converters allow for easy interfacing with analog sensors and signals, enhancing the microcontroller's versatility.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient and streamlined execution of instructions, improving overall system performance.

Connectivity: I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Multiple connectivity options provide flexibility for communication with various devices and peripherals, enhancing the microcontroller's usability in different applications.

Technical Specifications

Microcontrollers PIC32MX270F256B-I/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

19

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

65536

RAM Words:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Maximum Supply Current:

37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(6), POR, PWM, RTC, TIMER(5), USB, WDT

Analog To Digital Convertors:

9-Ch 10-Bit

Trade Compliance

PIC32MX270F256B-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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