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PIC32MX250F256LT-I/PT

Microchip Technology

PIC32MX250F256LT-I/PT by Microchip Technology

PIC32MX250F256LT-I/PT by Microchip: 32-bit RISC CPU, 3.6V max supply voltage, 40MHz clock freq. Ideal for industrial applications requiring high-speed processing, with features like 48-Ch ADCs, 4 DMA channels, and multiple connectivity options (I2C, SPI, UART).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,365 parts In-Stock

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Nova Conductors

Japan . 38 parts In-Stock

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38

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AZTECH Wire

Italy . 406 parts In-Stock

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$10.192

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406

$10.192

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Aztec Data Supply Inc.

USA . 3,439 parts In-Stock

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$15.393

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Ampacity Inc.

Singapore . 650 parts In-Stock

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$23.000

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$23.000

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Corohmni

South Africa . 303 parts In-Stock

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$60.827

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303

$60.827

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Marpe Global Electronics

Taiwan . 5,313 parts In-Stock

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QualityLine Systems

Poland . 5,313 parts In-Stock

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XL Components Corporation

Australia . 5,313 parts In-Stock

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Continental Prestige Electronics

USA . 4,975 parts In-Stock

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Argo Parts USA

USA . 4,557 parts In-Stock

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Formix International (Excess)

India . 988 parts In-Stock

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Aranea Global

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Overview

Discover the power and precision of the Microchip Technology PIC32MX250F256LT-I/PT microcontroller. With a wide range of applications in various industries, this top-of-the-line product offers unparalleled quality and reliability. From its advanced peripherals to its low power mode, this versatile device provides customers with unbeatable value and performance. Trust in the expertise of Microchip Technology and experience the benefits of cutting-edge technology at your fingertips. Elevate your projects with the PIC32MX250F256LT-I/PT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

This feature allows for easy and secure installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources, increasing its flexibility in different applications.

On Chip Data RAM Width: 32

A 32-bit data RAM width ensures efficient data processing and storage capabilities, enhancing the performance of the microcontroller.

Address Bus Width: 16

A 16-bit address bus width enables the microcontroller to access a larger memory space, making it suitable for complex tasks and applications.

Package Shape: SQUARE

The square package shape facilitates easy integration into circuit layouts and minimizes wasted space on the board.

Bit Size: 32

A 32-bit architecture provides high computing power and precision for handling complex algorithms and calculations.

No. of Terminals: 100

With a large number of terminals, this microcontroller offers ample connectivity options for interfacing with various external devices and peripherals.

Package Style (Meter): FLATPACK, THIN PROFILE

The thin profile of the flatpack package style saves space and allows for compact designs in electronic systems.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage ensures efficient power consumption, making the microcontroller suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the microcontroller to perform reliably in demanding environmental conditions.

CPU Family: PIC32

Being part of the PIC32 family, this microcontroller offers a proven and trusted architecture for a wide range of applications.

No. of External Interrupts: 5

With multiple external interrupts, the microcontroller can efficiently respond to external events and stimuli, enhancing its versatility.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures the microcontroller can function reliably in extreme cold environments.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, ensuring secure connections and long-term reliability.

ADC Channels: YES

The presence of analog-to-digital converter channels enables the microcontroller to interface with analog sensors and signals, expanding its range of applications.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and offload the CPU, enhancing overall system performance.

Terminal Position: QUAD

The quad terminal position configuration simplifies soldering and assembly, making the microcontroller easy to work with during production.

ROM Words: 65536

With a large ROM capacity, the microcontroller can store a substantial amount of program data, enabling the execution of complex programs.

Maximum Seated Height: 1.2 mm

The low seated height of the microcontroller allows for slim and compact designs in electronic devices and systems.

Technical Specifications

Microcontrollers PIC32MX250F256LT-I/PT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

3KB BOOT FLASH AVAILABLE

Address Bus Width:

16

Bit Size:

32

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

85

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.55SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Connectivity:

I2C(2), SPI(4), UART(5)

Peripherals:

ANALOG COMPARATOR(3), DMA(4), POR, PWM, TIMER(5), WDT

Analog To Digital Convertors:

48-Ch 10-Bit

Trade Compliance

PIC32MX250F256LT-I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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