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PIC32MX250F128DT-V/ML

Microchip Technology

PIC32MX250F128DT-V/ML by Microchip Technology

PIC32MX250F128DT-V/ML by Microchip: 32-bit RISC CPU, 131072 ROM words, 32768 RAM bytes. Ideal for industrial applications requiring low power consumption and high-speed processing. Features include 13-Ch ADC, 5 timers, and connectivity options like I2C, SPI, UART.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,120 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 766 parts In-Stock

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$10.455

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766

$10.455

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Ampacity Inc.

Singapore . 1,313 parts In-Stock

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$35.000

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Aztec Data Supply Inc.

USA . 287 parts In-Stock

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$71.584

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287

$71.584

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Corohmni

South Africa . 195 parts In-Stock

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$72.244

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195

$72.244

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Continental Prestige Electronics

USA . 6,892 parts In-Stock

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RGB Technical Solutions

Ukraine . 6,333 parts In-Stock

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Argo Parts USA

USA . 5,277 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Overview

Experience the power and versatility of the PIC32MX250F128DT-V/ML microcontroller by Microchip Technology. Designed for a wide range of applications, this high-quality product offers customers unparalleled performance and reliability. With advanced features such as multiple peripherals, low power mode, and a maximum clock frequency of 40 MHz, this microcontroller provides exceptional value and benefits to users looking for cutting-edge technology. Trust in Microchip Technology's expertise and innovation to take your projects to the next level with the PIC32MX250F128DT-V/ML.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for a wide range of applications.

On Chip Data RAM Width: 8

Provides sufficient memory for data storage and processing tasks.

Bit Size: 32

High data processing capability due to 32-bit architecture.

Maximum Clock Frequency: 40 MHz

Fast clock speed ensuring efficient performance.

No. of External Interrupts: 5

Allows for multiple external events to trigger interrupts, improving responsiveness.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient instruction processing and reduced power consumption.

Analog To Digital Convertors: 13-Ch 10-Bit

Enables precise analog signal conversion for various sensor applications.

Connectivity: I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Versatile connectivity options for interfacing with a wide range of devices.

Low Power Mode: YES

Enables power-saving operation, ideal for battery-powered devices.

Technical Specifications

Microcontrollers PIC32MX250F128DT-V/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

33

No. of Serial I/Os:

4

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

30 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

8 mm

Peripheral IC Type:

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

13-Ch 10-Bit

Trade Compliance

PIC32MX250F128DT-V/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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