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PIC32MX230F128LT-I/PT

Microchip Technology

PIC32MX230F128LT-I/PT by Microchip Technology

PIC32MX230F128LT-I/PT by Microchip: 32-bit RISC CPU, 3.6V max supply voltage, 40MHz clock freq. Ideal for industrial applications with ADC, DMA, PWM, UART connectivity and low power mode. Contains 48-Ch 10-Bit ADCs, FLASH ROM programmability and operates in -40 to 85°C range.

Median Price

$5.633

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$5.633

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300

$5.633

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Vyrian

USA . 7,640 parts In-Stock

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7,640

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 223 parts In-Stock

1+ parts

$4.899

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$4.899

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Continental Prestige Electronics

USA . 1,946 parts In-Stock

1+ parts

$5.633

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$5.521

1,946

$5.633

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$5.521

Netroflash

USA . 50 parts In-Stock

1+ parts

$5.633

100+ parts

-

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$5.352

10k+ parts

$5.239

50

$5.633

-

$5.352

$5.239

Ampacity Inc.

Singapore . 150 parts In-Stock

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$35.000

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$35.000

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Corohmni

South Africa . 192 parts In-Stock

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$36.746

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192

$36.746

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Aztec Data Supply Inc.

USA . 1,894 parts In-Stock

1+ parts

$62.020

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1,894

$62.020

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RGB Technical Solutions

Ukraine . 4,388 parts In-Stock

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Argo Parts USA

USA . 3,481 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the PIC32MX230F128LT-I/PT microcontroller from Microchip Technology. Designed with precision and innovation, this device offers unrivaled performance and reliability for a wide range of applications. Seamlessly integrating advanced features such as analog comparators, PWM channels, and UART connectivity, this microcontroller is the perfect solution for your next project. Experience unparalleled efficiency and versatility with the PIC32MX230F128LT-I/PT, setting a new standard in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, ideal for portable and long-lasting electronic devices.

Surface Mount: YES

Being surface mountable allows for easy assembly on PCBs, saving space and enabling efficient mass production of electronic devices.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can withstand varying power inputs, providing flexibility in different usage scenarios.

On Chip Data RAM Width: 32

The wide on-chip data RAM width of 32 bits allows for efficient data processing and storage, enhancing the performance of the microcontroller.

Address Bus Width: 16

A 16-bit address bus width enables the microcontroller to access a larger memory space, making it suitable for handling complex computational tasks.

Package Shape: SQUARE

The square package shape offers easy integration and alignment on circuit boards, simplifying the design process for electronic devices.

Bit Size: 32

A 32-bit architecture provides high processing power and capability, making this microcontroller suitable for advanced applications that require complex computations.

No. of Terminals: 100

The ample number of terminals allows for versatile connectivity options, making it compatible with a wide range of external devices and peripherals.

Package Style (Meter): FLATPACK, THIN PROFILE

The flatpack, thin profile package style ensures space-saving design and efficient heat dissipation, making it suitable for compact electronic devices.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage requirement allows for operation in energy-efficient setups, making this microcontroller a good choice for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environments and temperature fluctuations, ensuring reliable performance in various conditions.

CPU Family: PIC32

Belonging to the PIC32 CPU family ensures compatibility with a range of development tools and software libraries, facilitating programming and debugging processes.

No. of External Interrupts: 5

The presence of 5 external interrupts enhances the microcontroller's responsiveness to real-time events, making it suitable for time-sensitive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature capability allows for reliable operation in cold climates or industrial environments, expanding the range of potential applications for this microcontroller.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and ensures stable electrical connections, increasing the reliability and longevity of the microcontroller.

ADC Channels: YES

The inclusion of ADC channels enables analog-to-digital conversion, making this microcontroller suitable for applications that require sensor interfacing or data acquisition.

DMA Channels: YES

The availability of DMA channels offloads data transfer tasks from the CPU, enhancing system efficiency and enabling faster data processing in real-time applications.

Terminal Position: QUAD

The quad terminal position facilitates secure mounting and soldering on PCBs, ensuring stable connections and ease of assembly during production.

ROM Words: 32768

The large number of ROM words offers ample storage for program code, allowing for the implementation of complex algorithms and applications on this microcontroller.

Maximum Seated Height: 1.2 mm

The low maximum seated height provides a slim profile for the microcontroller, enabling compact device designs and easy integration into space-constrained applications.

Technical Specifications

Microcontrollers PIC32MX230F128LT-I/PT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

3KB BOOT FLASH AVAILABLE

Address Bus Width:

16

Bit Size:

32

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

85

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.55SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

4096

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Connectivity:

I2C(2), SPI(4), UART(5)

Peripherals:

ANALOG COMPARATOR(3), DMA(4), POR, PWM, TIMER(5), WDT

Analog To Digital Convertors:

48-Ch 10-Bit

Trade Compliance

PIC32MX230F128LT-I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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