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PIC32MX230F128L-50I/PF

Microchip Technology

PIC32MX230F128L-50I/PF by Microchip Technology

PIC32MX230F128L-50I/PF by Microchip: 32-bit RISC CPU, 40 MHz clock, 48-Ch ADC. Ideal for industrial applications requiring low power consumption and high-speed processing with peripherals like USB, UART, and SPI connectivity. Features include 16384 RAM words, 131072 ROM words, and a max supply voltage of 3.6 V.

Median Price

$5.957

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

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$5.957

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Vyrian

USA . 7,177 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,858 parts In-Stock

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$5.957

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$5.838

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$5.838

AZTECH Wire

Italy . 757 parts In-Stock

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$5.988

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Microchip USA

USA . 1,392 parts In-Stock

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$15.562

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Ampacity Inc.

Singapore . 490 parts In-Stock

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$20.000

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490

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Aztec Data Supply Inc.

USA . 174 parts In-Stock

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$25.480

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174

$25.480

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Corohmni

South Africa . 774 parts In-Stock

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$40.621

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Argo Parts USA

USA . 2,871 parts In-Stock

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Fulton Briggs Corp.

USA . 2,216 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$5.838

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$5.659

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$5.540

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$5.540

Overview

Discover the cutting-edge PIC32MX230F128L-50I/PF microcontroller by industry leader Microchip Technology. This versatile device offers unparalleled quality and reliability, ideal for a wide range of applications. With advanced features like DMA channels, PWM channels, and multiple connectivity options, this product delivers exceptional value and performance to customers. Unlock endless possibilities with the PIC32MX230F128L-50I/PF and experience the next level in microcontroller technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments and applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in powering the microcontroller and accommodating different voltage requirements in the system.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture ensures efficient processing of instructions, resulting in faster operation and improved performance.

Analog To Digital Convertors: 48-Ch 10-Bit

Having a high number of ADC channels and 10-bit resolution allows for accurate and precise analog signal conversions, essential in many applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy efficient and reliable.

Connectivity: I2C(2), I2S(4), SPI(4), UART(5), USB

With multiple communication interfaces, the microcontroller can easily connect to various devices and peripherals, providing versatility in system integration.

Maximum Clock Frequency: 40 MHz

The high clock frequency enables rapid processing of instructions, enhancing the overall performance of the microcontroller.

RAM Words: 16384

Having a large RAM capacity allows for efficient data storage and processing, making the microcontroller suitable for complex applications.

ROM Programmability: FLASH

Flash ROM allows for easy and quick reprogramming of the microcontroller, enabling flexibility in updating firmware and software.

Technical Specifications

Microcontrollers PIC32MX230F128L-50I/PF attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

3KB BOOT FLASH AVAILABLE

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

81

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Speed:

50 rpm

Maximum Supply Current:

32 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(4), SPI(4), UART(5), USB

Peripherals:

BOD, COMPARATOR(3), DMA(6), POR, RTC, TIMER(5)

Analog To Digital Convertors:

48-Ch 10-Bit

Trade Compliance

PIC32MX230F128L-50I/PF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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