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PIC32MX210F016BT-I/ML

Microchip Technology

PIC32MX210F016BT-I/ML by Microchip Technology

PIC32MX210F016BT-I/ML by Microchip: 32-bit RISC microcontroller with 40 MHz clock, 4096 RAM bytes, and 9-Ch 10-Bit ADC channels. Ideal for industrial applications requiring low power mode, featuring I2C(2), SPI(2), UART(2) connectivity options.

Median Price

$2.110

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$2.110

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Vyrian

USA . 7,963 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,425 parts In-Stock

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$2.110

100+ parts

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$2.068

6,425

$2.110

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$2.068

Argo Parts USA

USA . 2,655 parts In-Stock

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$2.110

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Netroflash

USA . 100 parts In-Stock

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$2.110

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100

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Ampacity Inc.

Singapore . 857 parts In-Stock

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$4.000

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$4.000

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AZTECH Wire

Italy . 367 parts In-Stock

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$5.951

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367

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Microchip USA

USA . 2,663 parts In-Stock

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$16.835

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2,663

$16.835

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Corohmni

South Africa . 495 parts In-Stock

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$59.782

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NIA Electronics

USA . 7,808 parts In-Stock

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Ledger Components

France . 7,808 parts In-Stock

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Montano Global Distributors

Canada . 7,557 parts In-Stock

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LMD Electronica

Estonia . 3,146 parts In-Stock

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LOOK Integrated Logistics

Peru . 2,292 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the PIC32MX210F016BT-I/ML microcontroller by Microchip Technology. Designed with precision and reliability in mind, this product offers a wide range of applications in the microcontrollers category. Experience seamless connectivity and high performance with features like ADC channels, DMA channels, PWM channels, and more. With a maximum clock frequency of 40 MHz and low power mode capabilities, this microcontroller provides unparalleled value and benefits to customers looking for top-tier performance in their projects. Trust Microchip Technology to deliver quality and innovation every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to damage, ensuring the longevity of the product.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage, providing flexibility in power supply options and potentially increasing performance.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle larger data sizes and calculations more efficiently.

No. of Terminals: 28

With a sufficient number of terminals, this microcontroller can support multiple connections and external components for versatile applications.

Maximum Operating Temperature: 85 °C

Can operate at higher temperatures, making it suitable for industrial applications where heat may be a factor.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a Reduced Instruction Set Computing (RISC) architecture in a microcontroller ensures efficient processing and optimal performance.

Analog To Digital Convertors: 9-Ch 10-Bit

With 9 channels and 10-bit resolution, this microcontroller can accurately convert analog signals to digital data for various sensor interfaces and inputs.

Technical Specifications

Microcontrollers PIC32MX210F016BT-I/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

19

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Analog To Digital Convertors:

9-Ch 10-Bit

Trade Compliance

PIC32MX210F016BT-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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