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PIC32MX170F512L-50I/PT

Microchip Technology

PIC32MX170F512L-50I/PT by Microchip Technology

PIC32MX170F512L-50I/PT by Microchip: 32-bit RISC CPU, 524288 ROM words, 65536 RAM words. Ideal for industrial applications requiring high-speed processing with peripherals like BOR, PWM, and RTC. Operates at up to 50 MHz clock frequency in a compact square package with low power mode.

Median Price

$8.010

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 71 parts In-Stock

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$7.347

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$7.249

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$7.249

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DigiKey

USA . 595 parts In-Stock

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$8.010

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$6.670

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595

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$6.670

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Microchip Technology

USA . 477 parts In-Stock

1+ parts

$8.010

100+ parts

$6.670

1k+ parts

$6.120

10k+ parts

$5.810

477

$8.010

$6.670

$6.120

$5.810

Mouser Electronics

USA . 240 parts In-Stock

1+ parts

$8.010

100+ parts

$6.670

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$6.660

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240

$8.010

$6.670

$6.660

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Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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$6.762

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500

$6.762

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Maritex

Poland . 468 parts In-Stock

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$14.822

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468

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Vyrian

USA . 8,044 parts In-Stock

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Flip Electronics

USA . 350 parts In-Stock

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350

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Distributors (Availability)

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Ampacity Inc.

Singapore . 26 parts In-Stock

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$6.240

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26

$6.240

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AZTECH Wire

Italy . 790 parts In-Stock

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$6.595

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$6.595

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Continental Prestige Electronics

USA . 1,683 parts In-Stock

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$6.762

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$6.627

1,683

$6.762

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$6.627

Netroflash

USA . 1,000 parts In-Stock

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$6.762

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Fulton Briggs Corp.

USA . 3,940 parts In-Stock

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Lixinc

USA . 899 parts In-Stock

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Argo Parts USA

USA . 635 parts In-Stock

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635

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Overview

Unleash the power of innovation with the Microchip Technology PIC32MX170F512L-50I/PT microcontroller. Crafted by industry leader Microchip Technology, this versatile device is designed to revolutionize the world of microcontrollers. With a wide range of applications in various industries, this cutting-edge product offers unparalleled value and benefits to customers. Experience seamless connectivity, high performance, and low power consumption, all packed into a compact and robust package. Trust Microchip Technology to deliver quality and reliability that exceeds expectations. Elevate your projects with the PIC32MX170F512L-50I/PT and unlock endless possibilities in the world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for greater flexibility in power supply options.

ROM Words: 524288

The large ROM capacity enables the storage of a significant amount of program data.

ADC Channels: YES

The presence of analog to digital converters allows for easy interfacing with analog sensors and signals.

Connectivity: I2C(2), I2S(4), IRDA, LIN, SPI(4), UART(5)

Multiple connectivity options provide versatility in communication protocols for various applications.

Speed: 50 rpm

The speed of 50 rpm allows for efficient processing and response times in real-time applications.

Technical Specifications

Microcontrollers PIC32MX170F512L-50I/PT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

85

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Bytes:

65536

RAM Words:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Speed:

50 rpm

Maximum Supply Current:

32 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(4), IRDA, LIN, SPI(4), UART(5)

Peripherals:

BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

48-Ch 10-Bit

Trade Compliance

PIC32MX170F512L-50I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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