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PIC32MX170F256DT-50I/PT

Microchip Technology

PIC32MX170F256DT-50I/PT by Microchip Technology

PIC32MX170F256DT-50I/PT by Microchip: 32-bit RISC CPU, 262144 ROM words, 65536 RAM bytes. Ideal for industrial applications requiring high-speed processing and low power consumption. Features include 13-Ch ADC, 5 timers, and multiple connectivity options like I2C, SPI, UART.

Median Price

$5.917

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$5.917

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10

$5.917

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Vyrian

USA . 2,839 parts In-Stock

1+ parts

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2,839

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,468 parts In-Stock

1+ parts

$5.917

100+ parts

-

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$5.799

2,468

$5.917

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$5.799

AZTECH Wire

Italy . 384 parts In-Stock

1+ parts

$8.658

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384

$8.658

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Semicontronic

India . 785 parts In-Stock

1+ parts

$21.000

100+ parts

$20.475

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$20.370

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785

$21.000

$20.475

$20.370

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Microchip USA

USA . 3,596 parts In-Stock

1+ parts

$32.305

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3,596

$32.305

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Ampacity Inc.

Singapore . 1,157 parts In-Stock

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$33.000

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1,157

$33.000

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Lixinc

USA . 3,847 parts In-Stock

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3,847

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RGB Technical Solutions

Ukraine . 3,511 parts In-Stock

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3,511

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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$5.799

1k+ parts

$5.621

10k+ parts

$5.503

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$5.799

$5.621

$5.503

Argo Parts USA

USA . 1,933 parts In-Stock

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Overview

Experience the power of innovation with the PIC32MX170F256DT-50I/PT by Microchip Technology. As a leader in microcontrollers, Microchip Technology delivers cutting-edge technology that exceeds expectations. Ideal for a wide range of applications, this microcontroller offers high performance and reliability. With features like low power mode, analog to digital convertors, and multiple connectivity options, this product provides unmatched value and benefits to customers looking for top-notch quality in their electronic devices. Elevate your projects with the exceptional capabilities of the PIC32MX170F256DT-50I/PT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount design allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power requirements in different systems.

On Chip Data RAM Width: 8

The 8-bit data RAM width ensures efficient data processing and storage capabilities for optimal performance.

Screening Level: TS 16949

This screening level ensures high quality and reliability, making this microcontroller suitable for automotive applications and other critical systems.

Package Shape: SQUARE

The square package shape provides a compact footprint, ideal for space-constrained designs.

Bit Size: 32

The 32-bit architecture offers enhanced processing power and efficiency, making this microcontroller suitable for complex applications.

No. of Terminals: 44

With 44 terminals, this microcontroller offers ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, THIN PROFILE

The thin profile flatpack package style saves space and allows for efficient PCB layout.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and extends the versatility of this microcontroller.

Technical Specifications

Microcontrollers PIC32MX170F256DT-50I/PT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

35

No. of Serial I/Os:

4

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP44,.39SQ,31

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

13-Ch 10-Bit

Trade Compliance

PIC32MX170F256DT-50I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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