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PIC32MX170F256D-V/TL

Microchip Technology

PIC32MX170F256D-V/TL by Microchip Technology

PIC32MX170F256D-V/TL by Microchip: 32-bit microcontroller with 262144 ROM words, 65536 RAM bytes, and 13-Ch 10-Bit ADC channels. Ideal for industrial applications requiring peripherals like BOR, PWM, and RTC. Operates at a max clock frequency of 40 MHz with connectivity options including I2C, SPI, and UART.

Median Price

$6.850

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 95 parts In-Stock

1+ parts

$6.850

100+ parts

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95

$6.850

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Vyrian

USA . 2,982 parts In-Stock

1+ parts

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2,982

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,688 parts In-Stock

1+ parts

$6.850

100+ parts

-

1k+ parts

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10k+ parts

$6.713

2,688

$6.850

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-

$6.713

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$6.850

100+ parts

$6.713

1k+ parts

-

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1,000

$6.850

$6.713

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AZTECH Wire

Italy . 448 parts In-Stock

1+ parts

$6.975

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448

$6.975

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Semicontronic

India . 403 parts In-Stock

1+ parts

$11.000

100+ parts

$10.725

1k+ parts

$10.670

10k+ parts

-

403

$11.000

$10.725

$10.670

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Ampacity Inc.

Singapore . 1,486 parts In-Stock

1+ parts

$19.000

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1,486

$19.000

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Fulton Briggs Corp.

USA . 3,048 parts In-Stock

1+ parts

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3,048

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Argo Parts USA

USA . 1,801 parts In-Stock

1+ parts

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1,801

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Microchip USA

USA . 315 parts In-Stock

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315

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Overview

Unlock endless possibilities with the PIC32MX170F256D-V/TL by Microchip Technology, a top-tier manufacturer of cutting-edge microcontrollers. Perfect for a wide range of applications, this device offers unparalleled value, benefits, and advantages to customers seeking high-quality solutions. With advanced features like ADC channels, DMA channels, and PWM capabilities, this product delivers exceptional performance and reliability. Trust Microchip Technology to provide you with the tools you need to bring your projects to life.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and reducing overall product size.

Maximum Supply Voltage: 3.6 V

Provides flexibility in powering the microcontroller, allowing for a wide range of power supply options.

Bit Size: 32

Offers high processing capability and versatility for handling complex tasks and calculations.

ROM Words: 262144

Ample storage capacity for program and data storage, enabling the implementation of various functions and features.

Maximum Clock Frequency: 40 MHz

High clock speed allows for quick data processing and efficient execution of instructions, enhancing overall performance.

RAM Bytes: 65536

Sufficient memory for storing and manipulating data during operation, ensuring smooth and efficient performance.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with a wide temperature range, ensuring reliability and durability in harsh conditions.

Connectivity: I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Multiple communication interfaces allow for seamless connectivity with various devices and peripherals, enhancing compatibility and flexibility.

Technical Specifications

Microcontrollers PIC32MX170F256D-V/TL attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

AEC-Q100 PLANNED, THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XBCC-B44

JESD-609 Code:

e4

Length:

6 mm

No. of I/O Lines:

35

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

13-Ch 10-Bit

Trade Compliance

PIC32MX170F256D-V/TL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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