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PIC32MX170F256B-I/ML

Microchip Technology

PIC32MX170F256B-I/ML by Microchip Technology

PIC32MX170F256B-I/ML by Microchip: 32-bit RISC microcontroller with 262144 ROM words, 65536 RAM bytes, and 10-Ch 10-Bit ADC channels. Ideal for industrial applications requiring a max clock frequency of 50 MHz, featuring low power mode and connectivity options like I2C, SPI, UART.

Median Price

$4.860

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 201 parts In-Stock

1+ parts

$4.860

100+ parts

$4.050

1k+ parts

-

10k+ parts

-

201

$4.860

$4.050

-

-

DigiKey

USA . 157 parts In-Stock

1+ parts

$4.860

100+ parts

$4.050

1k+ parts

-

10k+ parts

-

157

$4.860

$4.050

-

-

Microchip Technology

USA . 148 parts In-Stock

1+ parts

$4.860

100+ parts

$4.050

1k+ parts

$3.730

10k+ parts

$3.540

148

$4.860

$4.050

$3.730

$3.540

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 1,577 parts In-Stock

1+ parts

$3.813

100+ parts

-

1k+ parts

-

10k+ parts

-

1,577

$3.813

-

-

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Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$4.430

100+ parts

-

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10k+ parts

-

1,000

$4.430

-

-

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NAC Semi

USA . 122 parts In-Stock

1+ parts

$5.060

100+ parts

$4.590

1k+ parts

$4.200

10k+ parts

-

122

$5.060

$4.590

$4.200

-

Vyrian

USA . 4,484 parts In-Stock

1+ parts

-

100+ parts

-

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4,484

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-

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Bristol Electronics

USA . 40 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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40

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,043 parts In-Stock

1+ parts

$4.430

100+ parts

-

1k+ parts

-

10k+ parts

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3,043

$4.430

-

-

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Continental Prestige Electronics

USA . 621 parts In-Stock

1+ parts

$4.430

100+ parts

-

1k+ parts

-

10k+ parts

$4.341

621

$4.430

-

-

$4.341

Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

$4.430

100+ parts

$4.208

1k+ parts

$3.998

10k+ parts

$3.943

1,000

$4.430

$4.208

$3.998

$3.943

Advanced Electronics

New Zealand . 38 parts In-Stock

1+ parts

$4.518

100+ parts

$4.518

1k+ parts

$4.518

10k+ parts

-

38

$4.518

$4.518

$4.518

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AZTECH Wire

Italy . 526 parts In-Stock

1+ parts

$5.477

100+ parts

-

1k+ parts

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526

$5.477

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Aztec Data Supply Inc.

USA . 3,994 parts In-Stock

1+ parts

$28.845

100+ parts

-

1k+ parts

-

10k+ parts

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3,994

$28.845

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-

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Corohmni

South Africa . 191 parts In-Stock

1+ parts

$81.995

100+ parts

-

1k+ parts

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10k+ parts

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191

$81.995

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Lixinc

USA . 19,695 parts In-Stock

1+ parts

-

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19,695

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Fulton Briggs Corp.

USA . 4,636 parts In-Stock

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100+ parts

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4,636

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Overview

Unlock the power of innovation with the PIC32MX170F256B-I/ML by Microchip Technology. Designed with precision and reliability in mind, this microcontroller offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, this product delivers high-quality results that exceed expectations. Experience seamless connectivity, efficient power management, and advanced peripherals all in one compact package. Embrace the future of technology with the PIC32MX170F256B-I/ML and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for long-term use.

Surface Mount: YES

Allows for easy installation and integration into various systems.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options for different applications.

On Chip Data RAM Width: 8

Enables efficient data processing and storage capabilities.

Screening Level: TS 16949

Indicates high-quality manufacturing standards for improved performance.

Package Shape: SQUARE

Offers a compact design for space-efficient installations.

Bit Size: 32

Provides enhanced processing power for complex tasks.

No. of Terminals: 28

Allows for versatile connectivity options with other components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Ensures efficient heat dissipation and space-saving design.

Minimum Supply Voltage: 2.3 V

Offers compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

Suitable for operation in varying environmental conditions.

CPU Family: PIC32

Known for its reliability and compatibility with a wide range of applications.

No. of External Interrupts: 5

Provides flexibility in handling external events and inputs.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions without issues.

Terminal Finish: MATTE TIN

Ensures a reliable and secure electrical connection.

ADC Channels: YES

Enables analog-to-digital conversion for precise data acquisition.

DMA Channels: YES

Enhances data transfer efficiency and speed.

Terminal Position: QUAD

Facilitates easy installation and integration into systems.

ROM Words: 262144

Offers ample storage for program data and instructions.

Maximum Seated Height: 1 mm

Compact design for space-constrained applications.

RAM Words: 65536

Provides ample memory for data storage and processing.

Width: 6 mm

Compact form factor for easy integration into various systems.

Boundary Scan: YES

Facilitates troubleshooting and testing during manufacturing and maintenance.

Peripherals: BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT

Offers a wide range of peripherals for enhanced functionality.

Maximum Clock Frequency: 50 MHz

Provides high-speed processing capabilities for efficient performance.

Technical Specifications

Microcontrollers PIC32MX170F256B-I/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

21

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

65536

RAM Words:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Maximum Supply Current:

37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

PIC32MX170F256B-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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