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PIC32MX130F064D-V/ML

Microchip Technology

PIC32MX130F064D-V/ML by Microchip Technology

PIC32MX130F064D-V/ML by Microchip: 32-bit RISC CPU, 40 MHz clock, 13-Ch ADC for industrial applications. Features 16384 bytes RAM, 65536 ROM words, and 7 timers. Ideal for low power mode with peripherals like BOR, RTC, and WDT.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,231 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Corohmni

South Africa . 1,033 parts In-Stock

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$3.370

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Ampacity Inc.

Singapore . 1,209 parts In-Stock

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AZTECH Wire

Italy . 602 parts In-Stock

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Semicontronic

India . 1,404 parts In-Stock

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$22.310

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Aztec Data Supply Inc.

USA . 282 parts In-Stock

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$71.770

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RGB Technical Solutions

Ukraine . 8,274 parts In-Stock

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Argo Parts USA

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Aranea Global

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Overview

Experience the cutting-edge technology of the Microchip Technology PIC32MX130F064D-V/ML microcontroller, a powerful solution for your electronic projects. With a focus on quality and reliability, Microchip Technology is a trusted manufacturer in the industry, providing products that meet the highest standards. Ideal for a wide range of applications, this microcontroller offers unmatched value with its integrated cache, low power mode, and numerous peripherals including ADC and PWM channels. Discover the advantages of the PIC32MX130F064D-V/ML and take your projects to the next level with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Integrated Cache: YES

Improves the performance and efficiency of the microcontroller by providing quick access to frequently used data.

Maximum Supply Voltage: 3.6 V

Allows for a higher voltage input, providing flexibility in power supply options.

No. of Terminals: 44

Offers a sufficient number of terminals for connecting to various peripherals and components in a system.

Maximum Clock Frequency: 40 MHz

Enables fast processing speeds, suitable for applications requiring real-time data processing.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient and optimized performance in embedded applications.

ADC Channels: YES

Allows for analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer and reduced CPU workload.

Connectivity: I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Provides a wide range of communication interfaces for connecting with external devices and peripherals.

Speed: 40 rpm

Offers a high speed operation suitable for applications requiring rapid data processing and response times.

Technical Specifications

Microcontrollers PIC32MX130F064D-V/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

35

No. of Serial I/Os:

4

No. of Terminals:

44

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

30 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

8 mm

Peripheral IC Type:

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(4), POR, RTC, TIMER(7), WDT

Analog To Digital Convertors:

13-Ch 10-Bit

Trade Compliance

PIC32MX130F064D-V/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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