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PIC32MX120F032BT-I/SO

Microchip Technology

PIC32MX120F032BT-I/SO by Microchip Technology

PIC32MX120F032BT-I/SO by Microchip Technology is a 32-bit microcontroller with a max clock frequency of 40 MHz. It features 10-ch 10-bit ADC channels, 4 DMA channels, and connectivity options such as I2C, SPI, and UART. This microcontroller is commonly used in industrial applications due to its low power mode and temperature grade suitability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 12,902 parts In-Stock

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12,902

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Corohmni

South Africa . 147 parts In-Stock

1+ parts

$3.535

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147

$3.535

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AZTECH Wire

Italy . 315 parts In-Stock

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$15.853

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315

$15.853

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Microchip USA

USA . 2,881 parts In-Stock

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$17.745

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2,881

$17.745

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Semicontronic

India . 520 parts In-Stock

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$20.000

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$19.500

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$19.400

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520

$20.000

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$19.400

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Ampacity Inc.

Singapore . 561 parts In-Stock

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$29.000

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561

$29.000

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Aztec Data Supply Inc.

USA . 335 parts In-Stock

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$31.777

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335

$31.777

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West Coast Incorporated

USA . 6,215 parts In-Stock

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Continental Prestige Electronics

USA . 5,201 parts In-Stock

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Argo Parts USA

USA . 2,021 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Discover the power and versatility of the PIC32MX120F032BT-I/SO by Microchip Technology. As a leading manufacturer in the industry, Microchip brings you a top-quality microcontroller that delivers exceptional performance and reliability. This product is perfect for a wide range of applications, offering customers endless possibilities. With its advanced features and cutting-edge technology, the PIC32MX120F032BT-I/SO provides unparalleled value, benefits, and advantages. Experience seamless connectivity, high-speed processing, and low power consumption in a compact and durable package. Trust Microchip to provide you with the tools you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy body material ensures long-term reliability and protection for the microcontroller.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply design.

Bit Size: 32

32-bit processing capability provides enhanced performance and efficiency for complex applications.

No. of External Interrupts: 5

Multiple external interrupts allow for efficient handling of external events and improved responsiveness.

Package Style (Meter): SMALL OUTLINE

Compact small outline package allows for space-efficient placement in circuit designs.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast processing speeds and responsiveness for real-time applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Analog To Digital Convertors: 10-Ch 10-Bit

Multiple analog-to-digital converters with 10-bit resolution enable accurate analog signal processing.

Connectivity: I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Versatile connectivity options allow for seamless integration with various communication protocols and devices.

No. of I/O Lines: 21

Sufficient I/O lines provide flexibility for connecting to external peripherals and sensors.

Technical Specifications

Microcontrollers PIC32MX120F032BT-I/SO attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

21

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

PIC32MX120F032BT-I/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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