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PIC32MK1024GPK064-E/MR

Microchip Technology

PIC32MK1024GPK064-E/MR by Microchip Technology

PIC32MK1024GPK064-E/MR by Microchip Technology is a 32-bit microcontroller with 64 MHz clock frequency, 262144 RAM bytes, and 1048576 ROM words. It is ideal for automotive applications due to its low power mode, 26-Ch ADCs, and extensive peripheral support including USB, SPI, and UART interfaces.

Median Price

$8.860

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$8.860

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$8.860

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Vyrian

USA . 1,971 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,913 parts In-Stock

1+ parts

$8.860

100+ parts

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$8.683

4,913

$8.860

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$8.683

Netroflash

USA . 50 parts In-Stock

1+ parts

$8.860

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$8.860

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Ampacity Inc.

Singapore . 1,044 parts In-Stock

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$11.000

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$11.000

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AZTECH Wire

Italy . 454 parts In-Stock

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$12.427

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454

$12.427

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Corohmni

South Africa . 513 parts In-Stock

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$81.403

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513

$81.403

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QUARKTWIN TECHNOLOGY LTD

USA . 23,022 parts In-Stock

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NIA Electronics

USA . 4,606 parts In-Stock

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4,606

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Ledger Components

France . 4,606 parts In-Stock

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LMD Electronica

Estonia . 4,398 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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LOOK Integrated Logistics

Peru . 540 parts In-Stock

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540

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Argo Parts USA

USA . 429 parts In-Stock

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Montano Global Distributors

Canada . 12 parts In-Stock

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Overview

Unleash the power of innovation with the PIC32MK1024GPK064-E/MR by Microchip Technology. As a leader in the microcontroller industry, Microchip delivers top-quality products that redefine possibilities. Ideal for a wide range of applications, this microcontroller offers unparalleled value, benefits, and advantages to customers seeking reliability and performance. Elevate your projects to new heights with the PIC32MK1024GPK064-E/MR and experience the difference that excellence in technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and ensures the longevity of the microcontroller.

Integrated Cache: YES

Integrated cache helps in speeding up data access and processing, enhancing overall performance.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options.

DAC Channels: YES

Having DAC channels enables the microcontroller to convert digital signals to analog signals for a variety of applications.

CPU Family: PIC32

Being part of the PIC32 CPU family ensures compatibility with other PIC32 products and tools, offering ease of integration.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals to digital signals, expanding its sensing capabilities.

DMA Channels: YES

DMA channels help in efficient data transfer between peripherals and memory, reducing CPU overhead and improving overall performance.

ROM Words: 1048576

Large ROM capacity allows for storing a significant amount of program data, making it suitable for complex applications.

Maximum Clock Frequency: 64 MHz

High maximum clock frequency enables faster processing speed, making it suitable for real-time applications.

Technical Specifications

Microcontrollers PIC32MK1024GPK064-E/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

64 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

8

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N64

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

8

No. of External Interrupts:

5

No. of I/O Lines:

49

No. of Serial I/Os:

12

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

262144

RAM Words:

262144

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

80 rpm

Maximum Supply Current:

83 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

CSP , I2C(4), LIN, PMP, SPI(6), UART(6), USB

Peripherals:

BOR, COMPARATOR(5), DMA(8), DMT, DTC, LCD, POR, PWM(12), QEI, RTC, TIMER(9), WDT

Analog To Digital Convertors:

26-Ch 12-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

PIC32MK1024GPK064-E/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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