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PIC24FJ256GB606T-I/MR

Microchip Technology

PIC24FJ256GB606T-I/MR by Microchip Technology

PIC24FJ256GB606T-I/MR by Microchip Technology is a 16-bit microcontroller with 262144 ROM words, 32768 RAM bytes, and 16-Ch 12-Bit ADC channels. It operates at a max clock frequency of 32 MHz and features connectivity options like I2C(3), IRDA(2), SPI(3), UART(6). Ideal for industrial applications requiring low power mode and high-speed processing capabilities.

Median Price

$5.430

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 6,419 parts In-Stock

1+ parts

$5.430

100+ parts

$4.520

1k+ parts

-

10k+ parts

$4.520

6,419

$5.430

$4.520

-

$4.520

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,779 parts In-Stock

1+ parts

-

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-

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8,779

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Nova Conductors

Japan . 10 parts In-Stock

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-

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,858 parts In-Stock

1+ parts

$10.050

100+ parts

-

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10k+ parts

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2,858

$10.050

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AZTECH Wire

Italy . 153 parts In-Stock

1+ parts

$15.710

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153

$15.710

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Corohmni

South Africa . 93 parts In-Stock

1+ parts

$83.507

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-

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93

$83.507

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Marpe Global Electronics

Taiwan . 7,962 parts In-Stock

1+ parts

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7,962

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QualityLine Systems

Poland . 7,962 parts In-Stock

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7,962

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XL Components Corporation

Australia . 7,962 parts In-Stock

1+ parts

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7,962

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Netroflash

USA . 100 parts In-Stock

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100

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Overview

Elevate your projects with the PIC24FJ256GB606T-I/MR by Microchip Technology, a top-quality microcontroller that combines cutting-edge technology with reliable performance. This versatile chip offers a wide range of applications in various industries, from automotive to industrial automation. With its advanced features and low power mode, this Microchip product delivers exceptional value and benefits to customers, making it the ideal choice for your next innovative project. Trust Microchip Technology to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides mechanical protection and insulation for the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage, providing flexibility in power supply options.

No. of Terminals: 64

The high number of terminals allows for versatile connectivity options and integration with other components.

ADC Channels: YES

The presence of Analog to Digital Converters enables the microcontroller to interface with and process analog signals.

Maximum Clock Frequency: 32 MHz

The high clock frequency allows for fast processing speeds and responsiveness in applications.

RAM Bytes: 32768

The ample amount of RAM allows for efficient data storage and processing within the microcontroller.

ROM Programmability: FLASH

Flash ROM programmability enables easy and flexible reprogramming of the microcontroller for different functions or updates.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller's peripheral IC type ensures efficient and optimized performance in various applications.

Connectivity: I2C(3), IRDA(2), SPI(3), UART(6)

Multiple connectivity options like I2C, IRDA, SPI, and UART enhance the microcontroller's communication capabilities with other devices.

Low Power Mode: YES

The availability of low power mode helps in reducing power consumption, making the microcontroller suitable for energy-efficient applications.

Technical Specifications

Microcontrollers PIC24FJ256GB606T-I/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

ITS ALSO AVAILABLE WITH 16-CH 10-BIT

Address Bus Width:

16

Bit Size:

16

Boundary Scan:

YES

CPU Family:

PIC24

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

No. of External Interrupts:

5

No. of I/O Lines:

53

No. of Serial I/Os:

1

No. of Terminals:

64

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

ISO/TS-16949

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Current:

7.7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(2), SPI(3), UART(6)

Peripherals:

BOR, COMPARATOR(3), DMA(8), POR, PWM(6), RTC, TIMER(7), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

PIC24FJ256GB606T-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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