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PIC24F32KA304T-I/MV

Microchip Technology

PIC24F32KA304T-I/MV by Microchip Technology

PIC24F32KA304T-I/MV by Microchip: 16-bit, 32 MHz MCU with 2048 RAM bytes, 512 EEPROM size. Ideal for industrial applications requiring low power mode, featuring 16-Ch ADC and connectivity via I2C, SPI, UART interfaces.

Median Price

$3.390

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$3.390

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100

$3.390

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Vyrian

USA . 2,544 parts In-Stock

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2,544

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,543 parts In-Stock

1+ parts

$3.390

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2,543

$3.390

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Continental Prestige Electronics

USA . 1,732 parts In-Stock

1+ parts

$3.390

100+ parts

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$3.322

1,732

$3.390

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$3.322

Netroflash

USA . 100 parts In-Stock

1+ parts

$3.390

100+ parts

-

1k+ parts

$3.221

10k+ parts

$3.153

100

$3.390

-

$3.221

$3.153

Corohmni

South Africa . 117 parts In-Stock

1+ parts

$5.395

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117

$5.395

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AZTECH Wire

Italy . 610 parts In-Stock

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$7.504

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610

$7.504

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Semicontronic

India . 612 parts In-Stock

1+ parts

$15.000

100+ parts

$14.625

1k+ parts

$14.550

10k+ parts

-

612

$15.000

$14.625

$14.550

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Aztec Data Supply Inc.

USA . 285 parts In-Stock

1+ parts

$48.820

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285

$48.820

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Perfect Parts

USA . 55,440 parts In-Stock

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Lixinc

USA . 16,487 parts In-Stock

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16,487

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LOOK Integrated Logistics

Peru . 7,512 parts In-Stock

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7,512

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Montano Global Distributors

Canada . 4,668 parts In-Stock

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NIA Electronics

USA . 3,010 parts In-Stock

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3,010

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Ledger Components

France . 3,010 parts In-Stock

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3,010

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LMD Electronica

Estonia . 2,470 parts In-Stock

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2,470

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Overview

Enhance your projects with the PIC24F32KA304T-I/MV by Microchip Technology, a top-tier microcontroller that guarantees optimal performance and reliability. Crafted by industry leader Microchip Technology, this device is designed to elevate your creations to new heights. With a wide array of applications in various industries, this microcontroller offers unmatched value and benefits to customers. Experience seamless connectivity, low power consumption, and high-speed processing with the PIC24F32KA304T-I/MV, making it the perfect choice for your next innovation. Upgrade your projects today with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Epoxy material provides good durability and resistance to environmental factors, making the product suitable for a variety of applications.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for compatibility with a wider range of power sources, increasing flexibility in system design.

On Chip Data RAM Width: 8

Having a wider data RAM width enables faster data processing and storage capabilities within the microcontroller.

Surface Mount: YES

Surface mount packaging simplifies PCB assembly processes, making it easier for manufacturers to integrate the microcontroller into their designs.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast data processing and efficient operation of the microcontroller in demanding applications.

Technical Specifications

Microcontrollers PIC24F32KA304T-I/MV attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

PIC24

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

3

No. of I/O Lines:

39

No. of Serial I/Os:

6

No. of Terminals:

48

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2048

ROM Words:

11264

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

.55 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Minimum Time:

SECONDS

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

512

Connectivity:

I2C(2), SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(3), POR, PWM(3), RTCC, TIMER(7), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

PIC24F32KA304T-I/MV Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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