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PIC24F32KA304T-I/ML

Microchip Technology

PIC24F32KA304T-I/ML by Microchip Technology

PIC24F32KA304T-I/ML by Microchip: 16-bit, 32 MHz CPU with 2048 RAM bytes and 512 EEPROM size. Ideal for industrial applications requiring low power mode, featuring 16-Ch ADCs, I2C/SPI/UART connectivity, and FLASH ROM programmability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,356 parts In-Stock

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7,356

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Chip Stock

USA . 7,300 parts In-Stock

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7,300

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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AZTECH Wire

Italy . 271 parts In-Stock

1+ parts

$17.818

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271

$17.818

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Ampacity Inc.

Singapore . 229 parts In-Stock

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$31.000

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229

$31.000

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Aztec Data Supply Inc.

USA . 240 parts In-Stock

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$65.977

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240

$65.977

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Corohmni

South Africa . 332 parts In-Stock

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$82.696

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332

$82.696

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QUARKTWIN TECHNOLOGY LTD

USA . 26,536 parts In-Stock

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26,536

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Authorized Procurement Solutions

USA . 13,500 parts In-Stock

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13,500

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Metaverse IC Inc.

Canada . 9,600 parts In-Stock

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Continental Prestige Electronics

USA . 6,650 parts In-Stock

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Microchip USA

USA . 4,446 parts In-Stock

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Argo Parts USA

USA . 3,716 parts In-Stock

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3,716

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S.R.D Solutions

India . 3,000 parts In-Stock

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Lixinc

USA . 1,056 parts In-Stock

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Fulton Briggs Corp.

USA . 455 parts In-Stock

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455

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Discover the unbeatable performance of the PIC24F32KA304T-I/ML by Microchip Technology, a top-tier microcontroller that delivers unparalleled reliability and efficiency. Designed with cutting-edge technology, this versatile chip is ideal for a wide range of applications, providing seamless connectivity and precise control. With its advanced features and robust construction, customers can trust in the quality and value that Microchip Technology brings to the table. Elevate your projects to the next level with the PIC24F32KA304T-I/ML and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and reliability.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation onto a circuit board.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources.

On Chip Data RAM Width: 16

The 16-bit data RAM width enhances the processing capabilities of the microcontroller.

Screening Level: TS-16949

The TS-16949 screening level ensures high quality and consistency in production.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easy placement on a circuit board.

Bit Size: 16

The 16-bit architecture provides high-speed processing capabilities for various applications.

Power Supplies (V): 2/3.3

The availability of multiple power supply options makes this microcontroller versatile for different systems.

No. of Terminals: 44

The 44 terminals provide ample connectivity options for interfacing with other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer flexibility for different mounting and heat dissipation needs.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for efficient power consumption in battery-operated devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in harsh environments.

CPU Family: PIC24

The PIC24 CPU family is known for its high performance and reliability in microcontroller applications.

No. of External Interrupts: 3

The presence of 3 external interrupts allows for efficient handling of external events.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables operation in cold conditions without compromising performance.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and reliable connections.

ADC Channels: YES

The built-in ADC channels enable analog signal processing in real-time applications.

Terminal Position: QUAD

The quad terminal position simplifies the PCB layout and improves signal integrity.

ROM Words: 10922

The large ROM capacity allows for storing a significant amount of program code and data.

Maximum Seated Height: 1 mm

The low seated height makes this microcontroller suitable for compact designs with limited space.

RAM Words: 2048

The substantial RAM capacity enables efficient data storage and processing during operation.

Width: 8 mm

The slim width of 8mm makes it easy to integrate this microcontroller into various designs.

Data EEPROM Size: 512

The 512 bytes of EEPROM size offer additional non-volatile memory for storing critical data.

Peripherals: ANALOG COMPARATOR(3), BOR, POR, PWM(3), PWRT, RTC, TIMER(5), WDT

The wide range of peripherals enhance the functionality and versatility of this microcontroller.

Maximum Clock Frequency: 32 MHz

The high clock frequency enables fast and efficient execution of instructions for time-critical applications.

Technical Specifications

Microcontrollers PIC24F32KA304T-I/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

PIC24

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

3

No. of I/O Lines:

39

No. of Terminals:

44

No. of Timers:

7

On Chip Data RAM Width:

16

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.32SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2048

ROM Words:

10922

ROM Programmability:

FLASH

Screening Level:

TS-16949

Maximum Seated Height:

1 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Minimum Time:

SECONDS

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Peripheral IC Type:

Data EEPROM Size:

512

Connectivity:

I2C(2), SPI(2), UART(2)

Peripherals:

ANALOG COMPARATOR(3), BOR, POR, PWM(3), PWRT, RTC, TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

PIC24F32KA304T-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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