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PIC24EP64MC204-I/PT

Microchip Technology

PIC24EP64MC204-I/PT by Microchip Technology

PIC24EP64MC204-I/PT by Microchip: 16-bit RISC CPU, 60 MHz clock, 3.3 V supply. Ideal for industrial applications with ADC, DMA, PWM peripherals and connectivity options like I2C, SPI, UART. Low power mode and flash ROM make it versatile for various projects.

Median Price

$3.510

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 9,755 parts In-Stock

1+ parts

$3.510

100+ parts

$2.930

1k+ parts

$2.690

10k+ parts

$2.560

9,755

$3.510

$2.930

$2.690

$2.560

DigiKey

USA . 393 parts In-Stock

1+ parts

$3.510

100+ parts

$2.930

1k+ parts

-

10k+ parts

-

393

$3.510

$2.930

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-

Mouser Electronics

USA . 308 parts In-Stock

1+ parts

$3.510

100+ parts

$2.930

1k+ parts

-

10k+ parts

-

308

$3.510

$2.930

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 155 parts In-Stock

1+ parts

$3.650

100+ parts

$3.310

1k+ parts

$3.020

10k+ parts

-

155

$3.650

$3.310

$3.020

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Vyrian

USA . 4,832 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,832

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

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900

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,464 parts In-Stock

1+ parts

$2.980

100+ parts

-

1k+ parts

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10k+ parts

-

1,464

$2.980

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-

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Fulton Briggs Corp.

USA . 4,927 parts In-Stock

1+ parts

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100+ parts

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4,927

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Netroflash

USA . 500 parts In-Stock

1+ parts

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500

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Authorized Procurement Solutions

USA . 160 parts In-Stock

1+ parts

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100+ parts

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160

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GreenTree Electronics

Israel . 160 parts In-Stock

1+ parts

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160

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Overview

Unlock endless possibilities with the Microchip Technology PIC24EP64MC204-I/PT microcontroller. Designed with cutting-edge technology, this versatile device offers unparalleled performance and efficiency. Whether you're working on IoT projects, industrial automation, or consumer electronics, this microcontroller is the perfect solution. With its advanced features and reliable quality, the PIC24EP64MC204-I/PT ensures seamless operation and enhanced functionality, making it a valuable asset for any project. Upgrade your designs today with the Microchip Technology PIC24EP64MC204-I/PT microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in manufacturing.

Maximum Supply Voltage: 3.6 V

The higher supply voltage allows for greater flexibility in powering the microcontroller in different applications.

On Chip Data RAM Width: 8

The wider data RAM width enables faster data processing and manipulation within the microcontroller.

Package Shape: SQUARE

The square shape of the package provides a compact footprint, ideal for space-constrained designs.

Bit Size: 16

The 16-bit architecture allows for more complex calculations and operations to be performed by the microcontroller.

Power Supplies (V): 3.3

The standard power supply voltage of 3.3V ensures compatibility with a wide range of power sources and peripherals.

No. of Terminals: 44

Having a higher number of terminals provides more connectivity options and interfaces for external devices.

Package Style (Meter): FLATPACK, THIN PROFILE

The flatpack and thin profile package style saves space on the PCB and allows for a more streamlined design.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can perform reliably in harsh environmental conditions.

CPU Family: PIC24

Being part of the PIC24 CPU family ensures compatibility with existing PIC24-based designs and software libraries.

No. of External Interrupts: 3

Having multiple external interrupts allows the microcontroller to respond quickly to external events and triggers.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the microcontroller can operate in a wide range of environments, including cold climates.

Terminal Finish: MATTE TIN

Matte tin finish provides good electrical conductivity and corrosion resistance, ensuring long-term reliability of the terminals.

ADC Channels: YES

Analog to Digital Converter channels enable the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and offload the CPU for handling other tasks.

Terminal Position: QUAD

The quad terminal position provides a reliable connection and ease of PCB mounting.

ROM Words: 65536

Having a large ROM capacity allows for storing more program code and data, making the microcontroller suitable for complex applications.

Maximum Seated Height: 1.2 mm

The low seated height of the package allows for a slim and compact design, ideal for space-constrained applications.

RAM Words: 8192

The large RAM capacity enables the microcontroller to store and manipulate data efficiently during operation.

Width: 10 mm

The compact width of the microcontroller package allows for easy integration into tight spaces on the PCB.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microcontroller during development and production.

Peripherals: BOD, COMPARATOR(4), DMA(4), POR, PWM(4), RTCC, TIMER(5), WDT

A wide range of peripherals enhances the functionality and versatility of the microcontroller for different applications.

Maximum Clock Frequency: 60 MHz

With a high clock frequency, the microcontroller can execute instructions quickly, improving overall performance.

Maximum Time At Peak Reflow Temperature (s): 40

The microcontroller can withstand peak reflow temperatures for a sufficient duration during the soldering process.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliability during the assembly process.

Length: 10 mm

The compact length of the microcontroller package allows for flexible placement on the PCB and efficient use of space.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature range ensures reliable operation in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller enhances performance and efficiency in executing instructions.

No. of Timers: 5

Multiple timers provide flexibility in timing and scheduling tasks efficiently within the microcontroller.

RAM Bytes: 8192

The large RAM capacity in bytes allows for efficient data storage and manipulation during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form provides good solder joint reliability and ease of soldering during PCB assembly.

Analog To Digital Convertors: 9-Ch 12-Bit

Having multiple 12-bit ADC channels allows for precise and accurate analog-to-digital conversions for sensor inputs.

Maximum Supply Current: 60 mA

The maximum supply current of 60mA ensures efficient power consumption and minimizes heat dissipation.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and reliable operation of the microcontroller.

No. of DMA Channels: 4

Having 4 DMA channels enhances data transfer efficiency and reduces CPU workload for handling data.

PWM Channels: YES

Pulse Width Modulation channels allow for precise control of analog signals, ideal for motor control and power regulation.

Connectivity: I2C(2), IRDA, LIN, SPI(2), UART(2)

Multiple communication interfaces provide flexible connectivity options for interfacing with external devices and peripherals.

ROM Programmability: FLASH

Flash programmability allows for easy and quick firmware updates and reprogramming of the microcontroller.

Terminal Pitch: 0.8 mm

The tight terminal pitch of 0.8mm allows for high-density PCB routing and compact design layouts.

Format: FIXED POINT

Fixed-point format is efficient for numerical calculations, making the microcontroller suitable for math-intensive applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the microcontroller can withstand regular exposure to moisture during manufacturing and operation.

Speed: 70 rpm

With a speed of 70 rpm, the microcontroller can execute instructions and process data quickly for responsive performance.

Low Power Mode: YES

Low power mode enables power-saving operation, extending battery life and reducing energy consumption in the device.

On Chip Program ROM Width: 8

The wider on-chip program ROM width allows for storing more program code, enhancing the microcontroller's functionality.

No. of I/O Lines: 35

Having 35 I/O lines provides ample connectivity options for interfacing with external devices, sensors, and peripherals.

Technical Specifications

Microcontrollers PIC24EP64MC204-I/PT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

ALSO WORK AS 10-BIT ADC

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

PIC24

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of I/O Lines:

35

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

70 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOD, COMPARATOR(4), DMA(4), POR, PWM(4), RTCC, TIMER(5), WDT

Analog To Digital Convertors:

9-Ch 12-Bit

Trade Compliance

PIC24EP64MC204-I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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