Loading...

PIC18LF24K22T-I/MV

Microchip Technology

PIC18LF24K22T-I/MV by Microchip Technology

PIC18LF24K22T-I/MV by Microchip: 64 MHz clock, 3.6 V max supply, 768 RAM bytes. Ideal for industrial applications with peripherals like PWM(3) and ADC(17-Ch 10-Bit), offering low power mode and I2C/SPI connectivity.

Median Price

$3.540

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 73 parts In-Stock

1+ parts

$3.540

100+ parts

-

1k+ parts

-

10k+ parts

-

73

$3.540

-

-

-

Vyrian

USA . 496 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

496

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,446 parts In-Stock

1+ parts

$3.540

100+ parts

-

1k+ parts

-

10k+ parts

-

3,446

$3.540

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.540

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$3.540

-

-

-

Continental Prestige Electronics

USA . 1,039 parts In-Stock

1+ parts

$3.540

100+ parts

-

1k+ parts

-

10k+ parts

$3.469

1,039

$3.540

-

-

$3.469

AZTECH Wire

Italy . 775 parts In-Stock

1+ parts

$5.229

100+ parts

-

1k+ parts

-

10k+ parts

-

775

$5.229

-

-

-

Ampacity Inc.

Singapore . 831 parts In-Stock

1+ parts

$28.000

100+ parts

-

1k+ parts

-

10k+ parts

-

831

$28.000

-

-

-

Marpe Global Electronics

Taiwan . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7

-

-

-

-

QualityLine Systems

Poland . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7

-

-

-

-

XL Components Corporation

Australia . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7

-

-

-

-

Overview

Enhance your projects with the superior performance of the Microchip PIC18LF24K22T-I/MV microcontroller. Crafted by industry leader Microchip Technology, this powerful device offers unparalleled reliability and versatility in a compact package. Ideal for a wide range of applications, this microcontroller boasts advanced features such as DAC and ADC channels, multiple timers, low power mode, and more. Experience seamless connectivity with I2C, LIN, SPI, and USART interfaces, while enjoying the benefits of efficient power management and high-speed operation. Elevate your designs with the PIC18LF24K22T-I/MV and unlock endless possibilities in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology ensures easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages for flexibility in power requirements.

On Chip Data RAM Width: 8

Provides sufficient data storage capacity for processing and storing information during operation.

Package Shape: SQUARE

Square package shape enables easy integration into compact electronic designs.

Bit Size: 8

8-bit processing capability for handling various tasks efficiently.

DAC Channels: YES

Built-in DAC channels for analog signal generation and processing.

Power Supplies (V): 2/3.3

Supports multiple power supply options for compatibility with different systems.

No. of Terminals: 28

Sufficient number of terminals for connectivity with external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles to suit different mounting and cooling requirements.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage for efficient power management.

Maximum Operating Temperature: 85 °C

High operating temperature range suitable for industrial environments.

CPU Family: PIC18

Part of a proven and reliable CPU family for stable performance.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation in extreme conditions.

Terminal Finish: Matte Tin (Sn)

Matte tin finish for corrosion resistance and reliable connections.

ADC Channels: YES

Integrated ADC channels for analog signal conversion and processing.

Terminal Position: QUAD

Quad terminal position for secure and stable mounting on PCBs.

ROM Words: 8192

Sufficient ROM capacity for storing program code and data.

Maximum Seated Height: 0.55 mm

Low seated height for space-saving designs.

Digital To Analog Convertors: 1-Ch 5-Bit

Digital to analog converter for accurate analog signal output.

RAM Words: 768

Adequate RAM capacity for temporary data storage and processing.

Width: 4 mm

Compact width for integration into small electronic devices.

Data EEPROM Size: 256

EEPROM memory for non-volatile data storage and retrieval.

Peripherals: BOD, COMPARATOR(2), POR, PWM(3), TIMER(7), WDT

Various peripherals for enhanced functionality and control capabilities.

Maximum Clock Frequency: 64 MHz

High clock frequency for fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 40

Suitable for reflow soldering processes with a defined time limit.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable solder joints.

Length: 4 mm

Compact length for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for robust operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with Reduced Instruction Set Computing architecture for efficient processing.

No. of Timers: 7

Multiple timers for precise timing and scheduling of tasks.

RAM Bytes: 768

RAM capacity in bytes for efficient data handling and processing.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminal form for environmental compliance and safety.

Analog To Digital Convertors: 17-Ch 10-Bit

Multiple ADC channels for precise analog signal conversion and processing.

Maximum Supply Current: 12 mA

Low supply current requirement for energy-efficient operation.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage for reliable performance.

No. of DMA Channels: 3

DMA channels for efficient data transfer and processing.

PWM Channels: YES

Pulse width modulation channels for precise control of output signals.

Connectivity: I2C(2), LIN, SPI(2), USART(2)

Multiple communication interfaces for seamless connectivity with external devices.

ROM Programmability: FLASH

Flash ROM programmability for flexible firmware updates and customization.

Terminal Pitch: 0.4 mm

Fine terminal pitch for compact PCB layout and integration.

Format: FIXED POINT

Fixed-point format for efficient numerical processing and calculations.

Speed: 64 rpm

Fast processing speed for quick response and data handling.

Low Power Mode: YES

Low power mode for energy-saving operation and extended battery life.

On Chip Program ROM Width: 16

Wider on-chip program ROM width for storing program instructions and data.

No. of I/O Lines: 25

Adequate number of input/output lines for interfacing with external components and peripherals.

Technical Specifications

Microcontrollers PIC18LF24K22T-I/MV attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 20 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC18

Maximum Clock Frequency:

64 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

3

No. of I/O Lines:

25

No. of Terminals:

28

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.16SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

768

RAM Words:

768

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.55 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

I2C(2), LIN, SPI(2), USART(2)

Peripherals:

BOD, COMPARATOR(2), POR, PWM(3), TIMER(7), WDT

Analog To Digital Convertors:

17-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 5-Bit

Trade Compliance

PIC18LF24K22T-I/MV Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20