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PIC18F8585T-I/PT

Microchip Technology

PIC18F8585T-I/PT by Microchip Technology

PIC18F8585T-I/PT by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 40 MHz. It features 16-Ch 10-Bit ADC channels and offers connectivity options like CAN, I2C, SPI. Ideal for industrial applications requiring high-speed processing and multiple peripherals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,808 parts In-Stock

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5,808

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Semicontronic

India . 1,315 parts In-Stock

1+ parts

$10.000

100+ parts

$9.750

1k+ parts

$9.700

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1,315

$10.000

$9.750

$9.700

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AZTECH Wire

Italy . 468 parts In-Stock

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$16.033

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468

$16.033

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Aztec Data Supply Inc.

USA . 1,152 parts In-Stock

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$31.850

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$31.850

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Ampacity Inc.

Singapore . 988 parts In-Stock

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$35.000

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988

$35.000

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Corohmni

South Africa . 998 parts In-Stock

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$47.246

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998

$47.246

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Fulton Briggs Corp.

USA . 6,119 parts In-Stock

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Argo Parts USA

USA . 4,263 parts In-Stock

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Continental Prestige Electronics

USA . 912 parts In-Stock

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Microchip USA

USA . 287 parts In-Stock

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287

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Bastille Electronics

Australia . 93 parts In-Stock

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Overview

Experience the next level of innovation with the Microchip Technology PIC18F8585T-I/PT microcontroller. Known for its superior quality and reliability, Microchip Technology delivers cutting-edge solutions for a wide range of applications. This powerful microcontroller offers unmatched value and benefits to customers, providing seamless connectivity, high-speed performance, and advanced features. Elevate your projects with the PIC18F8585T-I/PT and unlock endless possibilities in the world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for efficient PCB assembly and space-saving design.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power supply options and can accommodate a wide range of input voltages.

Address Bus Width: 20

The 20-bit address bus width allows for a large memory address space, suitable for data-intensive applications.

Package Shape: SQUARE

Square package shape helps optimize PCB layout and space utilization.

Bit Size: 8

8-bit architecture offers a good balance between performance and cost for many embedded applications.

Power Supplies (V): 5

Standard 5V power supply simplifies system design and compatibility with other components.

No. of Terminals: 80

Large number of terminals provide ample I/O options for connecting to peripherals and external devices.

Minimum Supply Voltage: 4.2 V

Wide range of supply voltage support ensures reliable operation even in fluctuating power conditions.

Maximum Operating Temperature: 85 °C

High operating temperature tolerance makes it suitable for industrial applications with harsh environmental conditions.

CPU Family: PIC18

The PIC18 CPU family is known for its efficient and reliable performance in embedded systems.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, making the microcontroller versatile for sensor interfacing.

ROM Words: 24576

Large ROM storage capacity allows for storing program instructions and data for complex applications.

Maximum Clock Frequency: 40 MHz

High clock frequency provides fast processing speed and performance for real-time applications.

RAM Bytes: 3328

A generous amount of RAM enables efficient data storage and manipulation during program execution.

Technical Specifications

Microcontrollers PIC18F8585T-I/PT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

20

Bit Size:

8

CPU Family:

PIC18

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

69

No. of Terminals:

80

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

3328

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

CAN, I2C, PSP, SPI, USART

Peripherals:

BOD, POR, PWM(2), TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

PIC18F8585T-I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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