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PIC18F66K80-H/MR

Microchip Technology

PIC18F66K80-H/MR by Microchip Technology

PIC18F66K80-H/MR by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 64 MHz, suitable for automotive applications. It features 11-Ch 12-Bit ADC channels, 1024 bytes of data EEPROM size, and low power mode capability. With a package style of CHIP CARRIER and very thin profile, it offers versatile connectivity options like CAN and EUSART(2).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,749 parts In-Stock

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4,749

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,369 parts In-Stock

1+ parts

$3.000

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1,369

$3.000

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AZTECH Wire

Italy . 844 parts In-Stock

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$9.332

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844

$9.332

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Corohmni

South Africa . 378 parts In-Stock

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$47.382

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378

$47.382

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Aztec Data Supply Inc.

USA . 3,233 parts In-Stock

1+ parts

$65.453

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3,233

$65.453

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LMD Electronica

Estonia . 5,486 parts In-Stock

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5,486

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Argo Parts USA

USA . 5,277 parts In-Stock

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5,277

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NIA Electronics

USA . 4,997 parts In-Stock

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Ledger Components

France . 4,997 parts In-Stock

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Montano Global Distributors

Canada . 4,386 parts In-Stock

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4,386

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LOOK Integrated Logistics

Peru . 3,634 parts In-Stock

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3,634

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Continental Prestige Electronics

USA . 2,196 parts In-Stock

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2,196

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Aranea Global

USA . 500 parts In-Stock

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500

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Microchip USA

USA . 385 parts In-Stock

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385

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Overview

Discover the power and efficiency of the PIC18F66K80-H/MR microcontroller by Microchip Technology. Designed with precision and reliability in mind, this cutting-edge device offers unmatched performance for a wide range of applications. From automotive to industrial automation, the PIC18F66K80-H/MR delivers superior functionality and versatility. Experience seamless connectivity, low power consumption, and high-speed operation, all in a compact and durable package. Elevate your projects with the best-in-class technology from Microchip and unleash endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and manipulation, enhancing overall performance.

Screening Level: TS 16949

Compliance with TS 16949 screening standards ensures high quality and reliability in automotive applications.

Package Shape: SQUARE

The square package shape simplifies PCB layout and design, making it easier to integrate the microcontroller into a system.

Bit Size: 8

An 8-bit architecture offers a good balance between performance and cost, suitable for a wide range of embedded applications.

No. of Terminals: 64

Having a higher number of terminals provides more connectivity options and flexibility for interfacing with external devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers efficient heat dissipation and space-saving design.

Minimum Supply Voltage: 4 V

The low minimum supply voltage allows for operation in low-power or battery-powered applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures reliability in harsh environments and automotive applications.

CPU Family: PIC18

Being part of the PIC18 CPU family ensures compatibility with existing PIC microcontroller-based systems and development tools.

No. of External Interrupts: 4

Having multiple external interrupts allows the microcontroller to respond quickly to external events and improve real-time performance.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes the microcontroller suitable for use in extreme cold environments.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good conductivity and solderability, ensuring reliable connections during assembly.

ADC Channels: YES

Integrated ADC channels enable analog signal processing and sensor interfacing without the need for external components.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and soldering, making it easier to integrate the microcontroller into a system.

ROM Words: 32768

With 32K ROM words, the microcontroller offers ample space for program storage and flexibility in firmware development.

Maximum Seated Height: 1 mm

The low seated height allows for compact and slim designs, ideal for space-constrained applications.

RAM Words: 3648

Having 3648 RAM words provides sufficient memory for data storage and manipulation, enhancing overall system performance.

Width: 9 mm

Compact width dimensions make the microcontroller suitable for small form factor applications and space-constrained designs.

Data EEPROM Size: 1024

Having a 1024-byte EEPROM allows for non-volatile data storage and retrieval, suitable for storing configuration settings and calibration data.

Peripherals: ANALOG COMPARATOR(2), BOR, CTMU, POR, PWM, TIMER(5), WDT

The integrated peripherals provide versatile functionality for analog signal processing, power management, timing control, and watchdog functionality.

Maximum Clock Frequency: 64 MHz

The high clock frequency allows for fast processing and execution of instructions, improving overall system performance.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature specification ensures proper soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering and assembly under high-temperature manufacturing conditions.

Length: 9 mm

Compact length dimensions make the microcontroller suitable for small form factor applications and space-constrained designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature specifications ensure reliable operation in automotive applications under harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller offers enhanced performance and efficiency in processing and executing instructions.

No. of Timers: 5

Having multiple timers enables precise timing control and scheduling of tasks, improving system performance and functionality.

RAM Bytes: 3648

Having 3648 bytes of RAM provides ample memory for data storage and manipulation, enhancing overall system performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in operation.

Terminal Form: NO LEAD

The no-lead terminal form simplifies soldering and assembly processes, ensuring reliable connections and reducing manufacturing defects.

Analog To Digital Convertors: 11-Ch 12-Bit

With 11 channels of 12-bit ADCs, the microcontroller offers high-resolution analog signal processing capabilities for sensor interfacing and data acquisition.

Maximum Supply Current: 32 mA

The low maximum supply current ensures energy-efficient operation and minimizes power consumption in battery-powered applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage compatibility with standard 5V power sources ensures easy integration into existing systems and designs.

No. of Serial I/Os: 2

Having 2 serial I/O ports provides flexible connectivity options for communication with external devices and peripherals.

PWM Channels: YES

Integrated PWM channels enable precise control of analog output signals, suitable for motor control, lighting, and power management applications.

Connectivity: CAN, EUSART(2), MSSP

The integrated connectivity options of CAN, dual EUSART, and MSSP provide versatile communication capabilities for interfacing with different devices and networks.

ROM Programmability: FLASH

Flash programmability allows for easy and convenient firmware updates and modifications, enabling flexibility in software development and maintenance.

Terminal Pitch: 0.5 mm

The compact terminal pitch simplifies soldering and assembly processes, making it suitable for high-density PCB designs and miniaturized systems.

Format: FIXED POINT

The fixed-point format offers efficient numerical representation and computation, suitable for a wide range of embedded applications with fixed-point arithmetic requirements.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates the microcontroller's sensitivity to moisture and proper handling requirements during storage and assembly processes.

Speed: 64 rpm

The high clock speed of 64 MHz ensures fast data processing and execution, improving overall system performance and responsiveness.

Low Power Mode: YES

The low-power mode functionality allows for energy-efficient operation and prolonged battery life in power-constrained applications.

On Chip Program ROM Width: 8

Having an 8-bit program ROM width allows for efficient storage and execution of program instructions, enhancing system performance and responsiveness.

Technical Specifications

Microcontrollers PIC18F66K80-H/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC18

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

4

No. of I/O Lines:

54

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

3648

RAM Words:

3648

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

64 rpm

Maximum Supply Current:

32 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

1024

Connectivity:

CAN, EUSART(2), MSSP

Peripherals:

ANALOG COMPARATOR(2), BOR, CTMU, POR, PWM, TIMER(5), WDT

Analog To Digital Convertors:

11-Ch 12-Bit

Trade Compliance

PIC18F66K80-H/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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