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PIC18F24K22-E/ML

Microchip Technology

PIC18F24K22-E/ML by Microchip Technology

PIC18F24K22-E/ML by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 64 MHz. It features 768 bytes of RAM and 256 bytes of data EEPROM, making it suitable for automotive applications. With 17-channel 10-bit ADCs and various peripherals like PWM and timers, this CMOS technology-based microcontroller offers versatile connectivity options including I2C, LIN, SPI, and USART interfaces.

Median Price

$3.130

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 671 parts In-Stock

1+ parts

$3.130

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$2.600

1k+ parts

$2.390

10k+ parts

$2.280

671

$3.130

$2.600

$2.390

$2.280

DigiKey

USA . 303 parts In-Stock

1+ parts

$3.130

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$2.600

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303

$3.130

$2.600

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Mouser Electronics

USA . 265 parts In-Stock

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$3.130

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$2.600

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265

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$2.600

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Distributors (In-Stock)

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NAC Semi

USA . 549 parts In-Stock

1+ parts

$3.260

100+ parts

$2.960

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$2.710

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549

$3.260

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$2.710

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Vyrian

USA . 8,913 parts In-Stock

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Nova Conductors

Japan . 24 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,967 parts In-Stock

1+ parts

$2.660

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1,967

$2.660

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Aztec Data Supply Inc.

USA . 10 parts In-Stock

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$17.348

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10

$17.348

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Corohmni

South Africa . 259 parts In-Stock

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$49.769

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$49.769

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Lixinc

USA . 3,417 parts In-Stock

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Argo Parts USA

USA . 3,255 parts In-Stock

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Continental Prestige Electronics

USA . 2,817 parts In-Stock

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RGB Technical Solutions

Ukraine . 1,351 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Microchip Technology PIC18F24K22-E/ML microcontroller. Designed with precision and reliability in mind, this versatile chip offers a wide range of applications in various industries. With its advanced features and top-notch performance, this microcontroller delivers unmatched value and benefits to customers looking for seamless integration and efficient operation. Experience the difference that superior quality and innovation can make in your projects with the PIC18F24K22-E/ML by Microchip Technology.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Durable and lightweight material that can withstand various environmental conditions.

Maximum Supply Voltage 5.5 V

Allows for flexibility in power supply options and compatibility with different systems.

ADC Channels YES

Ability to convert analog signals into digital data for processing, making it suitable for sensor applications.

ROM Words 8192

Large memory capacity for storing program instructions and data.

Maximum Clock Frequency 64 MHz

High clock speed for fast processing of instructions and data.

Technology CMOS

Low power consumption and high noise immunity, ideal for battery-powered devices.

Analog To Digital Convertors 17-Ch 10-Bit

Multiple channels for converting analog signals with high resolution, suitable for precise measurements.

Connectivity I2C(2), LIN, SPI(2), USART(2)

Various communication interfaces for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers PIC18F24K22-E/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 2.3V MINIMUM SUPPLY AT 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC18

Maximum Clock Frequency:

64 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

3

No. of I/O Lines:

25

No. of Terminals:

28

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Bytes:

768

RAM Words:

768

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

I2C(2), LIN, SPI(2), USART(2)

Peripherals:

BOD, COMPARATOR(2), POR, PWM(3), TIMER(7), WDT

Analog To Digital Convertors:

17-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 5-Bit

Trade Compliance

PIC18F24K22-E/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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