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PIC16LF1788-E/SS

Microchip Technology

PIC16LF1788-E/SS by Microchip Technology

PIC16LF1788-E/SS by Microchip: 8-bit, 32MHz microcontroller with 2048B RAM, 256B EEPROM. Ideal for automotive applications with ADC/DAC channels, low power mode, and connectivity options like I2C/SPI.

Median Price

$2.850

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,485 parts In-Stock

1+ parts

$2.850

100+ parts

$2.350

1k+ parts

$2.160

10k+ parts

$2.070

2,485

$2.850

$2.350

$2.160

$2.070

Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$2.534

100+ parts

-

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300

$2.534

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NAC Semi

USA . 1,974 parts In-Stock

1+ parts

$2.940

100+ parts

$2.670

1k+ parts

$2.440

10k+ parts

-

1,974

$2.940

$2.670

$2.440

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Vyrian

USA . 4,519 parts In-Stock

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4,519

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Distributors (Availability)

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Ampacity Inc.

Singapore . 260 parts In-Stock

1+ parts

$2.420

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260

$2.420

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AZTECH Wire

Italy . 427 parts In-Stock

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$19.210

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427

$19.210

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NIA Electronics

USA . 7,945 parts In-Stock

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7,945

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Ledger Components

France . 7,945 parts In-Stock

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7,945

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Montano Global Distributors

Canada . 5,849 parts In-Stock

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5,849

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LMD Electronica

Estonia . 5,784 parts In-Stock

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LOOK Integrated Logistics

Peru . 206 parts In-Stock

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206

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Overview

Experience the cutting-edge technology with Microchip Technology's PIC16LF1788-E/SS microcontroller. Ideal for automotive applications, this small outline device offers 8-bit processing power, multiple ADC and DAC channels, and a wide range of connectivity options. With a maximum clock frequency of 32 MHz and low power mode capabilities, this microcontroller delivers high performance while conserving energy. Trust in Microchip Technology's reputation for quality and innovation, and take your projects to the next level with the PIC16LF1788-E/SS.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the microcontroller from external elements, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability makes it easy to integrate the microcontroller onto a PCB, saving space and simplifying the overall design.

Maximum Supply Voltage: 3.6 V

Ability to handle a maximum supply voltage of 3.6 V allows for flexible power supply options and compatibility with a wide range of applications.

On Chip Data RAM Width: 8

8-bit wide on-chip data RAM allows for efficient data processing and storage within the microcontroller.

Screening Level: TS 16949

TS 16949 screening level ensures high quality and reliability, making the microcontroller suitable for demanding automotive applications.

Package Shape: RECTANGULAR

Rectangular package shape enables easy placement and soldering onto a PCB, enhancing assembly efficiency.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost-effectiveness for a variety of applications.

DAC Channels: YES

Presence of DAC channels allows for analog output capabilities, expanding the range of possible applications for the microcontroller.

Power Supplies (V): 2/3.3

Support for both 2V and 3.3V power supplies offers flexibility in power management and integration with various components in a system.

No. of Terminals: 28

With 28 terminals, this microcontroller provides a sufficient number of I/O and power connection points for interfacing with external devices.

Technical Specifications

Microcontrollers PIC16LF1788-E/SS attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8V AT 16MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

NO

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

10.2 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

3

No. of I/O Lines:

25

No. of Serial I/Os:

1

No. of Terminals:

28

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

85 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

I2C, LIN, PMBUS, RS232, RS485, SMBUS, SPI, SSP, USART

Peripherals:

BOR, COMPARATOR(4), POR, PSMC(4), PWM(2), TIMER(3), WDT

Analog To Digital Convertors:

11-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit, 3-Ch 5-Bit

Trade Compliance

PIC16LF1788-E/SS Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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