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PIC16LC770-I/SO

Microchip Technology

PIC16LC770-I/SO by Microchip Technology

PIC16LC770-I/SO by Microchip Technology is an 8-bit microcontroller with 18 terminals, operating at a max clock frequency of 20 MHz. It features 256 bytes of RAM, 2048 ROM words, and 6-Ch 12-Bit ADC channels. Ideal for industrial applications requiring I2C and SPI connectivity, PWM control, and timers.

Median Price

$3.832

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.832

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10

$3.832

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Vyrian

USA . 5,674 parts In-Stock

1+ parts

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5,674

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A&K Electronics

USA . 266 parts In-Stock

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266

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Bristol Electronics

USA . 266 parts In-Stock

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266

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Distributors (Availability)

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Ampacity Inc.

Singapore . 5,934 parts In-Stock

1+ parts

$2.900

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5,934

$2.900

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Andel Nordic

Denmark . 1,301 parts In-Stock

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$3.111

100+ parts

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1k+ parts

$2.987

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$2.987

1,301

$3.111

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$2.987

$2.987

Continental Prestige Electronics

USA . 4,832 parts In-Stock

1+ parts

$3.832

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$3.755

4,832

$3.832

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$3.755

Argo Parts USA

USA . 4,175 parts In-Stock

1+ parts

$3.832

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4,175

$3.832

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Bastille Electronics

Australia . 91 parts In-Stock

1+ parts

$3.832

100+ parts

$3.640

1k+ parts

$3.458

10k+ parts

$3.410

91

$3.832

$3.640

$3.458

$3.410

AZTECH Wire

Italy . 333 parts In-Stock

1+ parts

$17.703

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333

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Microchip USA

USA . 1,289 parts In-Stock

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$23.933

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West Coast Incorporated

USA . 1,102 parts In-Stock

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Eastek

USA . 28 parts In-Stock

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Overview

Enhance your electronic projects with the Microchip Technology PIC16LC770-I/SO microcontroller. Known for its top-quality manufacturing and innovative technology, this product offers a wide range of applications in the field of microcontrollers. With features like low power consumption, high-speed performance, and multiple peripherals including BOD, POR, PWM, TIMER(3), and WDT, the PIC16LC770-I/SO provides exceptional value and benefits to customers looking for reliable and efficient solutions. Upgrade your designs today with this versatile and powerful microcontroller from Microchip Technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The PLASTIC/EPOXY material makes the microcontroller lightweight and durable, perfect for portable or long-lasting applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of devices.

Package Shape: RECTANGULAR

The rectangular package shape provides easy integration into various electronic designs and layouts.

Bit Size: 8

The 8-bit architecture is suitable for many embedded applications and offers a good balance between performance and cost.

Power Supplies (V): 3/5

The dual power supply options of 3V and 5V provide flexibility for different power requirements and compatibility with various components.

No. of Terminals: 18

The 18 terminals offer a sufficient number of connection points for interfacing with external devices and peripherals.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for compact and efficient designs.

Minimum Supply Voltage: 2.5 V

The low minimum supply voltage allows for operation in low-power environments and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes it suitable for industrial applications where temperature fluctuations are common.

Technical Specifications

Microcontrollers PIC16LC770-I/SO attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

PIC

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e3

Length:

22.8 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

16

No. of Terminals:

18

On Chip Program ROM Width:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

2048

ROM Programmability:

OTPROM

Maximum Seated Height:

4.32 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

BOD, POR, PWM, TIMER(3), WDT

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

PIC16LC770-I/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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