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PIC16LC554-04I/SS

Microchip Technology

PIC16LC554-04I/SS by Microchip Technology

PIC16LC554-04I/SS by Microchip: 8-bit, 512 ROM words, 80 RAM bytes. Ideal for industrial applications with -40 to 85 °C operating temp range. Features include POR, TIMER(3), low power mode.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,709 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Corohmni

South Africa . 426 parts In-Stock

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$4.420

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$4.420

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AZTECH Wire

Italy . 1,220 parts In-Stock

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$19.950

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Ampacity Inc.

Singapore . 585 parts In-Stock

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$21.000

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Microchip USA

USA . 1,225 parts In-Stock

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$28.535

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Semicontronic

India . 214 parts In-Stock

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$32.000

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$31.200

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$31.040

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$31.040

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NIA Electronics

USA . 8,236 parts In-Stock

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Ledger Components

France . 8,236 parts In-Stock

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LMD Electronica

Estonia . 8,165 parts In-Stock

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Argo Parts USA

USA . 5,039 parts In-Stock

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Montano Global Distributors

Canada . 3,997 parts In-Stock

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LOOK Integrated Logistics

Peru . 3,573 parts In-Stock

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Continental Prestige Electronics

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Netroflash

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Overview

Experience seamless performance and reliability with the PIC16LC554-04I/SS microcontroller by Microchip Technology. Designed with precision and innovation, this versatile microcontroller is perfect for a wide range of applications in the industrial sector. With its low power mode and high-speed processing capabilities, this microcontroller offers unrivaled value and efficiency to customers. Trust in Microchip Technology's expertise and quality to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and enhancing design flexibility.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, increasing compatibility with various power sources.

Screening Level: TS 16949

Meets quality standards set for automotive industry, making it suitable for automotive applications.

Package Shape: RECTANGULAR

Simplifies the placement of the microcontroller on a PCB and enhances ease of manufacturing.

Bit Size: 8

Offers a good balance between performance and complexity for a wide range of applications.

Power Supplies (V): 3/5

Supports different voltage requirements, enhancing compatibility with various systems.

No. of Terminals: 20

Provides sufficient interface options for connecting to other components within a circuit.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact design saves space on the PCB and allows for higher density integration of components.

Minimum Supply Voltage: 2.5 V

Allows the microcontroller to operate at lower power supply levels, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications that require robust performance.

CPU Family: PIC16

Part of a well-established and reliable microcontroller family known for its performance and versatility.

Low Power Mode: YES

Enables energy savings during idle or low usage periods, extending battery life in portable devices.

Technical Specifications

Microcontrollers PIC16LC554-04I/SS attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

4 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

7.2 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

1

No. of I/O Lines:

13

No. of Terminals:

20

No. of Timers:

3

On Chip Program ROM Width:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

80

ROM Words:

512

ROM Programmability:

OTPROM

Screening Level:

TS 16949

Maximum Seated Height:

2 mm

Speed:

4 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

2.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

POR, TIMER(3), WDT

Trade Compliance

PIC16LC554-04I/SS Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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