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PIC16F685-E/P

Microchip Technology

PIC16F685-E/P by Microchip Technology

PIC16F685-E/P by Microchip Technology is an 8-bit microcontroller with 256 bytes of RAM and 4096 ROM words. Operating at a max clock frequency of 20 MHz, it offers 12-Ch 10-Bit ADC channels and PWM support. Ideal for automotive applications due to AEC-Q100 screening level and wide temperature range from -40°C to 125°C.

Median Price

$3.040

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 46 parts In-Stock

1+ parts

$3.040

100+ parts

-

1k+ parts

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10k+ parts

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46

$3.040

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-

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Vyrian

USA . 5,604 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,604

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Chip Stock

USA . 535 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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535

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,158 parts In-Stock

1+ parts

$11.000

100+ parts

-

1k+ parts

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1,158

$11.000

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AZTECH Wire

Italy . 608 parts In-Stock

1+ parts

$16.207

100+ parts

-

1k+ parts

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608

$16.207

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Fulton Briggs Corp.

USA . 4,470 parts In-Stock

1+ parts

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100+ parts

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4,470

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Overview

Enhance your projects with the PIC16F685-E/P microcontroller from Microchip Technology. Designed for reliability and performance, this versatile device is perfect for a wide range of applications. With features like low power mode, PWM channels, and connectivity options like I2C and SPI, this microcontroller offers exceptional value and flexibility. Trust in the quality and expertise of Microchip Technology to bring your designs to life with the PIC16F685-E/P.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliable performance and portability.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power input, accommodating a range of voltage levels.

On Chip Data RAM Width: 8

Sufficient RAM width for efficient data processing and storage.

Screening Level: AEC-Q100; TS 16949

High-quality screening level ensures reliability in automotive applications.

Package Shape: RECTANGULAR

Compact rectangular shape allows for easy integration into various electronic devices.

Bit Size: 8

Standard bit size for compatibility with a wide range of systems and software.

Power Supplies (V): 2/5.5

Supports multiple power supply options for versatility in different environments.

No. of Terminals: 20

Sufficient terminals for connecting to various external components and peripherals.

Package Style (Meter): IN-LINE

In-line package style for easy board mounting and space-efficient design.

Minimum Supply Voltage: 4.5 V

Wide range of acceptable supply voltages ensures compatibility with different power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature for reliable performance in harsh environments.

CPU Family: PIC16

Belongs to a reputable CPU family known for quality and performance.

No. of External Interrupts: 2

Sufficient external interrupts for handling external events and tasks efficiently.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature for use in cold environments without performance degradation.

Terminal Finish: MATTE TIN

Matte tin finish for good electrical conductivity and soldering reliability.

ADC Channels: YES

Built-in Analog to Digital Converters for accurate sensing and data acquisition.

Terminal Position: DUAL

Dual terminal position for stable and secure connection with external devices.

ROM Words: 4096

Sufficient ROM capacity for storing program instructions and data.

Maximum Seated Height: 5.334 mm

Low profile design for space-constrained applications.

Width: 7.62 mm

Compact width for easy integration and board layout.

Data EEPROM Size: 256

Sufficient EEPROM size for non-volatile data storage.

Peripherals: BOD, COMPARATOR(2), POR, TIMER(2), WDT

Multiple peripherals for added functionality and versatility in applications.

Maximum Clock Frequency: 20 MHz

High clock frequency for fast processing and response times.

Length: 26.162 mm

Optimal length for fitting into various electronic enclosures.

Temperature Grade: AUTOMOTIVE

Designed and tested for automotive-grade performance and reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and streamlined processing capabilities.

No. of Timers: 2

Multiple timers for precise timing and event scheduling.

RAM Bytes: 256

Adequate RAM capacity for data processing and storage.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: THROUGH-HOLE

Through-hole terminal form for secure and reliable PCB mounting.

Analog To Digital Convertors: 12-Ch 10-Bit

Multiple analog to digital converters for accurate sensor interfacing and data conversion.

Maximum Supply Current: 5.45 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for broad compatibility.

PWM Channels: YES

PWM channels for precise control of analog outputs.

Connectivity: I2C, SPI, USB

Multiple connectivity options for interfacing with external devices and communication protocols.

ROM Programmability: FLASH

Flash ROM for easy and fast program updates and modifications.

Terminal Pitch: 2.54 mm

Standard terminal pitch for compatibility with common connectors and sockets.

Format: FIXED POINT

Fixed-point format for efficient numerical computations and data representation.

Speed: 20 rpm

Operates at a speed of 20 rotations per minute for precise timing and control.

Low Power Mode: YES

Low power mode for energy-saving and extended battery life.

Technical Specifications

Microcontrollers PIC16F685-E/P attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2V SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.162 mm

Low Power Mode:

YES

No. of External Interrupts:

2

No. of I/O Lines:

18

No. of Serial I/Os:

1

No. of Terminals:

20

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/5.5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

5.334 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

5.45 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

I2C, SPI, USB

Peripherals:

BOD, COMPARATOR(2), POR, TIMER(2), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

PIC16F685-E/P Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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