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PIC16F648A-I/ML

Microchip Technology

PIC16F648A-I/ML by Microchip Technology

PIC16F648A-I/ML by Microchip: 8-bit RISC microcontroller with 256B RAM, 256B EEPROM, and 4096 ROM words. Operates at up to 20MHz, suitable for industrial applications. Features USART connectivity, low power mode, and multiple peripherals like PWM and timers.

Median Price

$3.931

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 21 parts In-Stock

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$3.931

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Vyrian

USA . 6,325 parts In-Stock

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Cyclops Electronics Ltd

UK . 20 parts In-Stock

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20

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EMSNET

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Argo Parts USA

USA . 1,067 parts In-Stock

1+ parts

$3.931

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1,067

$3.931

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Continental Prestige Electronics

USA . 655 parts In-Stock

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$3.931

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$3.852

655

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$3.852

AZTECH Wire

Italy . 330 parts In-Stock

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$5.884

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330

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Ampacity Inc.

Singapore . 354 parts In-Stock

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$13.000

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354

$13.000

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Semicontronic

India . 850 parts In-Stock

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$20.000

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$19.500

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$19.400

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850

$20.000

$19.500

$19.400

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Fulton Briggs Corp.

USA . 5,725 parts In-Stock

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5,725

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Bastille Electronics

Australia . 200 parts In-Stock

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Perfect Parts

USA . 109 parts In-Stock

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Overview

Step into the future of technology with the PIC16F648A-I/ML microcontroller by Microchip Technology. Designed with precision and innovation, this versatile device is perfect for a wide range of applications. From smart home devices to industrial automation, the PIC16F648A-I/ML offers unparalleled performance and reliability. With its advanced features and high-quality construction, this microcontroller provides customers with exceptional value and endless possibilities. Embrace the power of Microchip Technology and elevate your projects to new heights with the PIC16F648A-I/ML.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration of the microcontroller onto circuit boards, saving space and enabling automated assembly.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can withstand voltage fluctuations and operate reliably in different power supply conditions.

Package Shape: SQUARE

The square shape of the package allows for easier placement on circuit boards and efficient use of space.

Bit Size: 8

8-bit architecture provides a good balance between processing power and cost, making this microcontroller suitable for a wide range of applications.

ROM Words: 4096

With a large ROM capacity, this microcontroller can store a substantial amount of program data, enabling complex functionalities and applications.

Maximum Clock Frequency: 20 MHz

A high clock frequency allows for fast processing speeds and efficient operation of the microcontroller in real-time applications.

RAM Bytes: 256

A sufficient amount of RAM enables efficient data processing and multitasking capabilities within the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable for long-term use.

Connectivity: USART

USART connectivity allows for easy communication with external devices, making this microcontroller suitable for applications requiring data transmission.

Technical Specifications

Microcontrollers PIC16F648A-I/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

1

No. of I/O Lines:

16

No. of Terminals:

28

No. of Timers:

3

On Chip Program ROM Width:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

USART

Peripherals:

BOD, COMPARATOR(2), POR, PWM, TIMER(3), WDT

Trade Compliance

PIC16F648A-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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