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PIC16F628AT-E/SO

Microchip Technology

PIC16F628AT-E/SO by Microchip Technology

PIC16F628AT-E/SO by Microchip: 8-bit microcontroller with 2048 ROM words, 128 EEPROM size, and 224 RAM bytes. Ideal for automotive applications with USART connectivity, 20 MHz clock frequency, and low power mode for efficient operation.

Median Price

$4.083

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

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$4.083

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300

$4.083

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Vyrian

USA . 2,068 parts In-Stock

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2,068

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 2,197 parts In-Stock

1+ parts

$4.083

100+ parts

$3.879

1k+ parts

$3.685

10k+ parts

$3.634

2,197

$4.083

$3.879

$3.685

$3.634

Continental Prestige Electronics

USA . 6,558 parts In-Stock

1+ parts

$4.083

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$4.001

6,558

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$4.001

Argo Parts USA

USA . 997 parts In-Stock

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$4.083

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997

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AZTECH Wire

Italy . 883 parts In-Stock

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$10.182

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883

$10.182

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Aztec Data Supply Inc.

USA . 2,610 parts In-Stock

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$28.960

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Corohmni

South Africa . 82 parts In-Stock

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$37.354

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82

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XL Components Corporation

Australia . 3,810 parts In-Stock

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QualityLine Systems

Poland . 1,994 parts In-Stock

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Marpe Global Electronics

Taiwan . 1,756 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Enhance your electronic projects with the PIC16F628AT-E/SO microcontroller from Microchip Technology. Designed with precision and reliability in mind, this small outline package offers 8-bit processing power with a maximum clock frequency of 20 MHz. Ideal for automotive applications, this microcontroller boasts low power consumption and a wide operating temperature range, making it a versatile choice for various projects. With features like data EEPROM size of 128, connectivity options with USART, and built-in peripherals like PWM channels and timers, the PIC16F628AT-E/SO delivers exceptional value and performance to customers seeking high-quality solutions for their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to damage, ensuring the long-term reliability of the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly on PCBs, saving time and effort during manufacturing.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can handle a wide range of input voltages, providing flexibility in different application scenarios.

Screening Level: TS 16949

Having a TS 16949 screening level ensures high quality and reliability, meeting automotive industry standards for performance and durability.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into standard PCB designs and layouts, making it compatible with a wide range of applications.

Bit Size: 8

With an 8-bit architecture, this microcontroller is suitable for handling a variety of tasks in embedded systems with moderate complexity.

RAM Bytes: 224

Ample RAM size allows for efficient data storage and processing, enabling the microcontroller to handle multiple tasks simultaneously.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency of 20 MHz ensures fast and responsive operation, making it suitable for applications requiring real-time processing.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller offers improved performance and efficiency compared to CISC architectures, making it a powerful choice for embedded systems.

Connectivity: USART

USART connectivity allows for communication with external devices and peripherals, increasing the versatility and compatibility of the microcontroller.

Technical Specifications

Microcontrollers PIC16F628AT-E/SO attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e3

Length:

11.55 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

1

No. of I/O Lines:

16

No. of Terminals:

18

No. of Timers:

3

On Chip Program ROM Width:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

224

ROM Words:

2048

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

128

Connectivity:

USART

Peripherals:

BOD, COMPARATOR(2), POR, PWM, TIMER(3), WDT

Trade Compliance

PIC16F628AT-E/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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