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PIC16F18325T-I/STVAO

Microchip Technology

PIC16F18325T-I/STVAO by Microchip Technology

PIC16F18325T-I/STVAO by Microchip is an 8-bit microcontroller with 14 terminals, operating at a max frequency of 32 MHz. It features ADC and DAC channels, along with peripherals like BOR, CCP, and PWM. Ideal for industrial applications requiring low power consumption and connectivity via I2C, SPI, and EUSART interfaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,872 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 280 parts In-Stock

1+ parts

$8.000

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280

$8.000

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AZTECH Wire

Italy . 420 parts In-Stock

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$19.564

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420

$19.564

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Semicontronic

India . 677 parts In-Stock

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$20.000

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$19.500

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$19.400

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677

$20.000

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$19.400

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Aztec Data Supply Inc.

USA . 537 parts In-Stock

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$37.470

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537

$37.470

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Corohmni

South Africa . 17 parts In-Stock

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$55.647

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17

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Advanced Electronics

New Zealand . 91 parts In-Stock

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$66.781

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$63.442

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$63.442

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91

$66.781

$63.442

$63.442

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Fulton Briggs Corp.

USA . 4,862 parts In-Stock

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Continental Prestige Electronics

USA . 4,437 parts In-Stock

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Microchip USA

USA . 1,247 parts In-Stock

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Bastille Electronics

Australia . 750 parts In-Stock

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Argo Parts USA

USA . 687 parts In-Stock

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Overview

Discover the power and efficiency of the PIC16F18325T-I/STVAO microcontroller by Microchip Technology. With a solid reputation for quality and reliability, this device is perfect for a wide range of applications in the microcontroller category. Offering a maximum clock frequency of 32 MHz and low power mode, this product delivers exceptional value and benefits to customers looking for high performance and energy-efficient solutions. Whether you're designing IoT devices, consumer electronics, or industrial control systems, the PIC16F18325T-I/STVAO is the perfect choice for your next project. Unlock the possibilities with Microchip Technology's innovative microcontroller technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the internal components of the microcontroller.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options, accommodating a wide range of voltage inputs.

ADC Channels: YES

Analog to Digital Converters enable the microcontroller to read and process analog signals, increasing the range of applications it can be used for.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing capabilities, making the microcontroller suitable for tasks that require quick execution.

Connectivity: I2C(2), SPI(2), EUSART

Multiple connectivity options enable easy integration with other devices, allowing for seamless communication in a variety of systems.

ROM Programmability: FLASH

Flash programmable memory allows for easy reprogramming of the microcontroller, simplifying the development and testing process.

Low Power Mode: YES

Low power mode helps conserve energy, making the microcontroller suitable for battery-powered applications or scenarios where power efficiency is crucial.

Technical Specifications

Microcontrollers PIC16F18325T-I/STVAO attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 2.3 V MINIMUM SUPPLY AT 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

5 mm

Low Power Mode:

YES

No. of I/O Lines:

12

No. of Serial I/Os:

1

No. of Terminals:

14

No. of Timers:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Maximum Supply Current:

3.1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Connectivity:

I2C(2), SPI(2), EUSART

Peripherals:

BOR, CCP(4), COMPARATOR(2), CLC(4), FVR, POR, PWM(2), TIMER(8), WDT

Analog To Digital Convertors:

11-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 5-Bit

Trade Compliance

PIC16F18325T-I/STVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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