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PIC16F1717-E/P

Microchip Technology

PIC16F1717-E/P by Microchip Technology

PIC16F1717-E/P by Microchip Technology is an 8-bit microcontroller with 5.5V max supply voltage, 32MHz clock frequency, and 1024 bytes of RAM. Ideal for automotive applications, it features 28-Ch 10-Bit ADCs, PWM channels, and connectivity options like EUSART, I2C, and SPI. With low power mode and FLASH ROM programmability, this microcontroller offers versatile performance in a compact package.

Median Price

$3.070

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 161 parts In-Stock

1+ parts

$3.070

100+ parts

$2.540

1k+ parts

-

10k+ parts

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161

$3.070

$2.540

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 30 parts In-Stock

1+ parts

$2.716

100+ parts

-

1k+ parts

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10k+ parts

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30

$2.716

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Vyrian

USA . 7,593 parts In-Stock

1+ parts

-

100+ parts

-

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7,593

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 81 parts In-Stock

1+ parts

$2.610

100+ parts

-

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81

$2.610

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.716

100+ parts

-

1k+ parts

$2.580

10k+ parts

$2.526

1,000

$2.716

-

$2.580

$2.526

AZTECH Wire

Italy . 216 parts In-Stock

1+ parts

$14.885

100+ parts

-

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216

$14.885

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West Coast Incorporated

USA . 7,270 parts In-Stock

1+ parts

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7,270

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Lixinc

USA . 1,787 parts In-Stock

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1,787

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Overview

Elevate your next project with the PIC16F1717-E/P by industry leader Microchip Technology. This high-quality microcontroller offers unparalleled performance and versatility, making it ideal for a wide range of applications. With features like multiple ADC and DAC channels, low power mode, and a maximum clock frequency of 32 MHz, this product provides exceptional value and benefits to customers seeking reliable and efficient solutions. Upgrade to the PIC16F1717-E/P and experience the difference in quality and performance today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options

On Chip Data RAM Width: 8

Efficient data storage and retrieval capabilities

Package Shape: RECTANGULAR

Compact design for space-saving installations

Bit Size: 8

Suitable for handling smaller data sizes efficiently

DAC Channels: YES

Ability to convert digital signals to analog for varied applications

No. of Terminals: 40

Sufficient connectivity options for peripheral devices

Package Style (Meter): IN-LINE

Easy to integrate into existing systems

Minimum Supply Voltage: 2.5 V

Operates efficiently with low power input

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments

CPU Family: PIC16

Well-established and reliable platform for microcontrollers

Minimum Operating Temperature: -40 °C

Operates reliably in extreme cold conditions

Terminal Finish: MATTE TIN

Corrosion-resistant finish for long-term reliability

ADC Channels: YES

Ability to convert analog signals to digital for diverse applications

Terminal Position: DUAL

Allows for versatile mounting options

ROM Words: 8192

Sufficient memory for program storage

Maximum Seated Height: 6.35 mm

Low profile design for compact installations

Digital To Analog Convertors: 1-Ch 5-Bit, 1-Ch 8-Bit

Offers versatile signal conversion options

Width: 15.24 mm

Compact dimensions for space-constrained applications

Data EEPROM Size: 128

Additional non-volatile memory for data storage

Peripherals: BOR, COMPARATOR(2), POR, PWM(2), TIMER(7), WDT

Wide range of integrated peripherals for enhanced functionality

Maximum Clock Frequency: 32 MHz

High-speed processing capabilities

Length: 51.75 mm

Optimal dimensions for various installations

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive operating conditions

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient RISC architecture for optimized performance

No. of Timers: 7

Multiple timer options for precise timing functions

RAM Bytes: 1024

Sufficient random access memory for data manipulation

Technology: CMOS

Low power consumption and reliable operation

Terminal Form: THROUGH-HOLE

Secure mounting for stable connections

Analog To Digital Convertors: 28-Ch 10-Bit

Extensive analog signal conversion capabilities

Nominal Supply Voltage: 3 V

Standard power input for compatibility with various systems

PWM Channels: YES

Offers pulse-width modulation capabilities for precise control

Connectivity: EUSART, I2C, SPI

Versatile communication interfaces for external devices

ROM Programmability: FLASH

Flexible program storage and update options

Terminal Pitch: 2.54 mm

Standard spacing for easy connection with external components

Format: FIXED POINT

Optimized data representation for efficient processing

Speed: 32 rpm

High processing speed for rapid data handling

Low Power Mode: YES

Energy-efficient mode for power savings

On Chip Program ROM Width: 14

Sufficient memory for storing program instructions

No. of I/O Lines: 36

Ample input/output options for connectivity with external devices

Technical Specifications

Microcontrollers PIC16F1717-E/P attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 2.3V MIN @ 16 MHZ

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

NO

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDIP-T40

JESD-609 Code:

e3

Length:

51.75 mm

Low Power Mode:

YES

No. of External Interrupts:

1

No. of I/O Lines:

36

No. of Serial I/Os:

1

No. of Terminals:

40

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

6.35 mm

Speed:

32 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Peripheral IC Type:

Data EEPROM Size:

128

Connectivity:

EUSART, I2C, SPI

Peripherals:

BOR, COMPARATOR(2), POR, PWM(2), TIMER(7), WDT

Analog To Digital Convertors:

28-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 5-Bit, 1-Ch 8-Bit

Trade Compliance

PIC16F1717-E/P Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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