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PIC16F1526T-I/MR

Microchip Technology

PIC16F1526T-I/MR by Microchip Technology

PIC16F1526T-I/MR by Microchip Technology is an 8-bit microcontroller with 64 terminals, operating at a max frequency of 20 MHz. It features 30-Ch 10-Bit ADC channels, 128 bytes Data EEPROM, and peripherals like BOD, POR, PWM(10), TIMER(9), WDT. Ideal for industrial applications requiring high-speed processing and extensive I/O capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,058 parts In-Stock

1+ parts

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4,058

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 732 parts In-Stock

1+ parts

$16.001

100+ parts

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732

$16.001

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Ampacity Inc.

Singapore . 724 parts In-Stock

1+ parts

$33.000

100+ parts

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724

$33.000

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Aztec Data Supply Inc.

USA . 81 parts In-Stock

1+ parts

$61.140

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81

$61.140

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Fulton Briggs Corp.

USA . 2,431 parts In-Stock

1+ parts

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2,431

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Microchip USA

USA . 1,376 parts In-Stock

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1,376

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Continental Prestige Electronics

USA . 1,305 parts In-Stock

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1,305

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Argo Parts USA

USA . 358 parts In-Stock

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358

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Unlock endless possibilities with the Microchip Technology PIC16F1526T-I/MR microcontroller. Designed with precision and reliability in mind, this versatile chip offers a wide range of applications in various industries. With advanced features like DAC channels, ADC channels, and PWM capabilities, this microcontroller provides unparalleled value and performance. Trust in Microchip Technology's reputation for excellence and innovation to take your projects to the next level. Elevate your designs and unleash your creativity with the PIC16F1526T-I/MR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the components inside, making it a reliable choice.

Surface Mount: YES

Allows for easy installation and space-saving design, ideal for compact electronic projects.

Maximum Supply Voltage: 5.5 V

With a high supply voltage, this microcontroller can handle a wide range of power sources, increasing versatility.

Package Shape: SQUARE

The square shape of the package offers easy integration and efficient use of space on PCBs.

Bit Size: 8

The 8-bit architecture provides a good balance between cost and performance for many applications.

DAC Channels: YES

Digital-to-analog converters allow for precise control of analog outputs, making this microcontroller suitable for sensor interfacing.

Power Supplies (V): 2.5/5

Dual power supply options provide flexibility in designing circuits and compatibility with various devices.

No. of Terminals: 64

Ample terminals allow for multiple connections, expanding the range of peripherals that can be interfaced with.

Package Style (Meter): CHIP CARRIER

The chip carrier style offers easy handling and installation, making it suitable for automated assembly processes.

Minimum Supply Voltage: 2.5 V

This low minimum voltage requirement ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

The high operating temperature range allows this microcontroller to be used in various environments without overheating.

CPU Family: PIC16

Belonging to the PIC16 family ensures compatibility with existing PIC controllers and tools, simplifying the design process.

Minimum Operating Temperature: -40 °C

Operates reliably even in extreme cold conditions, making it suitable for outdoor and industrial applications.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and durability, ensuring strong connections in circuit assembly.

ADC Channels: YES

Analog-to-digital converters enable precise measurement of analog signals, essential for many sensor applications.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and routing, saving space and reducing complexity.

ROM Words: 8192

With a large ROM capacity, this microcontroller can store complex algorithms and programs, suitable for applications that require extensive programming.

Maximum Seated Height: 1 mm

Low seated height facilitates compact design and integration in space-constrained applications.

Width: 9 mm

Compact width allows for efficient use of PCB real estate, ideal for miniaturized electronic designs.

Data EEPROM Size: 128

Ample EEPROM size enables data storage and retrieval, crucial for storing settings and parameters in embedded systems.

Peripherals: BOD, POR, PWM(10), TIMER(9), WDT

A wide range of peripherals support various functions, making this microcontroller versatile and adaptable to different applications.

Maximum Clock Frequency: 20 MHz

High clock frequency allows for fast data processing, critical for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 40

Supports efficient and reliable solder reflow processes for manufacturing, ensuring robust connections.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during manufacturing, ensuring component integrity and reliability.

Length: 9 mm

The compact length of the microcontroller allows for space efficiency on PCBs, ideal for designs with limited real estate.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes this microcontroller suitable for harsh operating conditions and industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enables efficient data processing and low power consumption, suitable for battery-powered applications.

RAM Bytes: 768

The generous RAM size supports complex data manipulation and processing, essential for multitasking applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures compatibility with lead-free solder processes.

Analog To Digital Convertors: 30-Ch 10-Bit

Multiple ADC channels with high resolution enable precise analog signal conversion, essential for accurate sensing applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage ensures compatibility with common power sources, simplifying the design process.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of various outputs, essential for motor control and dimming applications.

Connectivity: I2C(2), SPI(2), USART(2)

Multiple communication interfaces support versatile connectivity options, enabling seamless integration with other devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and customization of firmware, ensuring flexibility and adaptability.

Terminal Pitch: 0.5 mm

Fine terminal pitch supports high-density PCB layouts, ideal for miniaturized designs requiring multiple connections in tight spaces.

Speed: 20 rpm

The operating speed of 20 rpm ensures fast data processing and response times, suitable for real-time applications.

On Chip Program ROM Width: 14

Wide ROM width accommodates large programs and complex algorithms, critical for data-intensive applications.

No. of I/O Lines: 54

The abundance of I/O lines provides ample connectivity for interfacing with external devices and peripherals, making this microcontroller versatile and adaptable.

Technical Specifications

Microcontrollers PIC16F1526T-I/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.3 V MINIMUM SUPPLY AT 16 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

PIC16

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

54

No. of Terminals:

64

On Chip Program ROM Width:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

RAM Bytes:

768

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

128

Connectivity:

I2C(2), SPI(2), USART(2)

Peripherals:

BOD, POR, PWM(10), TIMER(9), WDT

Analog To Digital Convertors:

30-Ch 10-Bit

Trade Compliance

PIC16F1526T-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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