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PIC12F629-E/MF

Microchip Technology

PIC12F629-E/MF by Microchip Technology

PIC12F629-E/MF by Microchip Technology is an 8-bit microcontroller with 1024 ROM words and 128 bytes of data EEPROM. Operating at a max frequency of 20 MHz, it features 64 bytes of RAM and offers peripherals like BOD, comparator, POR, timers (4), and WDT. Ideal for automotive applications due to its temperature grade and small form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,114 parts In-Stock

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4,114

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Nova Conductors

Japan . 63 parts In-Stock

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63

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Distributors (Availability)

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Andel Nordic

Denmark . 4,056 parts In-Stock

1+ parts

$3.740

100+ parts

-

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$3.590

10k+ parts

$3.590

4,056

$3.740

-

$3.590

$3.590

Semicontronic

India . 297 parts In-Stock

1+ parts

$5.000

100+ parts

$4.875

1k+ parts

$4.850

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297

$5.000

$4.875

$4.850

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Ampacity Inc.

Singapore . 328 parts In-Stock

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$9.000

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328

$9.000

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AZTECH Wire

Italy . 198 parts In-Stock

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$18.268

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198

$18.268

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Aztec Data Supply Inc.

USA . 1,741 parts In-Stock

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$31.750

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1,741

$31.750

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Corohmni

South Africa . 423 parts In-Stock

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$70.724

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423

$70.724

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West Coast Incorporated

USA . 4,594 parts In-Stock

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4,594

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Argo Parts USA

USA . 2,812 parts In-Stock

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Continental Prestige Electronics

USA . 315 parts In-Stock

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315

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Experience the power and precision of the PIC12F629-E/MF microcontroller from Microchip Technology. Crafted with top-quality materials and cutting-edge technology, this small yet mighty device is perfect for a wide range of applications in the automotive industry and beyond. With its impressive features, such as a 20 MHz clock frequency and 1024 ROM words, this microcontroller offers unparalleled performance and reliability. Trust Microchip Technology to deliver exceptional products that exceed your expectations. Elevate your projects with the PIC12F629-E/MF and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with different systems.

ROM Programmability: FLASH

Flash ROM allows for convenient and flexible programming of the microcontroller, enabling easy updates and modifications.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency enables fast processing speeds, making the microcontroller suitable for time-sensitive applications.

Technology: CMOS

CMOS technology offers low power consumption and noise immunity, making the microcontroller energy-efficient and reliable in various environments.

Technical Specifications

Microcontrollers PIC12F629-E/MF attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

NO

Additional Features:

OPERATE AT 4MHZ AT 2VMIN

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC12

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

1

No. of I/O Lines:

6

No. of Terminals:

8

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.20,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

64

ROM Words:

1024

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

128

Peripherals:

BOD, COMPARATOR, POR, TIMER(4), WDT

Trade Compliance

PIC12F629-E/MF Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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