Loading...

PAC1951T-2E/J6CX

Microchip Technology

PAC1951T-2E/J6CX by Microchip Technology

POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 16; Package Code: BGA; Package Shape: RECTANGULAR; Surface Mount: YES; Length: 2.225 mm;

Median Price

$1.650

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 27,879 parts In-Stock

1+ parts

$1.160

100+ parts

$0.880

1k+ parts

$0.850

10k+ parts

$0.840

27,879

$1.160

$0.880

$0.850

$0.840

DigiKey

USA . 4,900 parts In-Stock

1+ parts

$1.650

100+ parts

$1.250

1k+ parts

-

10k+ parts

$1.250

4,900

$1.650

$1.250

-

$1.250

Mouser Electronics

USA . 4,566 parts In-Stock

1+ parts

$1.650

100+ parts

$1.380

1k+ parts

$1.250

10k+ parts

-

4,566

$1.650

$1.380

$1.250

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 6,874 parts In-Stock

1+ parts

$8.125

100+ parts

-

1k+ parts

-

10k+ parts

-

6,874

$8.125

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 19,095 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,095

-

-

-

-

Montano Global Distributors

Canada . 6,748 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,748

-

-

-

-

LMD Electronica

Estonia . 5,730 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,730

-

-

-

-

LOOK Integrated Logistics

Peru . 4,129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,129

-

-

-

-

NIA Electronics

USA . 1,376 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,376

-

-

-

-

Ledger Components

France . 1,376 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,376

-

-

-

-

Technical Specifications

Power Management ICs PAC1951T-2E/J6CX attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XBGA-B16

Length:

2.225 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

.679 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width (mm):

2.17 mm

Trade Compliance

PAC1951T-2E/J6CX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.