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MIC2981BN

Microchip Technology

MIC2981BN by Microchip Technology

MIC2981BN by Microchip Technology is a BUFFER OR INVERTER BASED PERIPHERAL DRIVER with 18 terminals. It operates b/w -40 to 85 °C, handling a max supply voltage of 50 V. Ideal for industrial applications, it offers built-in TRANSIENT protection and fast turn-on/off times of 2/10 us.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 4,665 parts In-Stock

1+ parts

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4,665

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Vyrian

USA . 979 parts In-Stock

1+ parts

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979

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Nova Conductors

Japan . 28 parts In-Stock

1+ parts

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28

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 571 parts In-Stock

1+ parts

$9.872

100+ parts

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1k+ parts

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571

$9.872

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Ampacity Inc.

Singapore . 418 parts In-Stock

1+ parts

$42.500

100+ parts

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418

$42.500

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Continental Prestige Electronics

USA . 6,860 parts In-Stock

1+ parts

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6,860

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Argo Parts USA

USA . 3,310 parts In-Stock

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3,310

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RGB Technical Solutions

Ukraine . 3,080 parts In-Stock

1+ parts

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3,080

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Experience the power of reliable performance with the MIC2981BN by Microchip Technology. As a top manufacturer in the industry, Microchip Technology's peripheral drivers like the MIC2981BN are designed to provide exceptional quality and durability for a wide range of applications. Offering built-in protections and a maximum supply voltage of 50V, this product ensures safe and efficient operation. With its industrial-grade temperature rating and fast turn-on time, the MIC2981BN delivers unmatched value and benefits to customers seeking a high-performing peripheral driver solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to impact, making the product suitable for industrial use.

Maximum Supply Voltage: 50 V

Supports a high supply voltage range, providing flexibility in various electrical applications.

Built-in Protections: TRANSIENT

Includes protection against transient events, ensuring reliable operation and safeguarding connected components.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, suitable for industrial settings where heat may be a concern.

Terminal Form: THROUGH-HOLE

The through-hole terminals allow for easy and secure soldering onto circuit boards, ensuring a reliable connection.

Technical Specifications

Peripheral Drivers MIC2981BN attributes and parameters. Explore more Peripheral Drivers devices from Microchip Technology

Specs

Additional Features:

LMAX ONLY GIVEN, SEATED HEIGHT CALCULATED

Built-in Protections:

TRANSIENT

JESD-30 Code:

R-PDIP-T18

Length:

23.37 mm

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

3.937 mm

Maximum Supply Voltage:

50 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

35 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Turn-off Time:

10 us

Turn-on Time:

2 us

Width:

7.62 mm

Trade Compliance

MIC2981BN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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