Loading...

MIC2215-PPMYML-TR

Microchip Technology

MIC2215-PPMYML-TR by Microchip Technology

FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR; No. of Terminals: 16; Package Code: HVQCCN; Terminal Form: NO LEAD; Maximum Input Voltage Absolute: 7 V; Maximum Voltage Tolerance: 2 %;

Median Price

$2.490

Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,926 parts In-Stock

1+ parts

$2.490

100+ parts

$2.013

1k+ parts

-

10k+ parts

-

4,926

$2.490

$2.013

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.549

100+ parts

$0.500

1k+ parts

$0.450

10k+ parts

-

100

$0.549

$0.500

$0.450

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

RGB Technical Solutions

Ukraine . 700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

700

-

-

-

-

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO MIC2215-PPMYML-TR attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Microchip Technology

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.275 V

Nominal Dropout Voltage-1:

.17 V

Maximum Dropout Voltage-2:

.275 V

Maximum Input Voltage Absolute:

7 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

4 V

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Maximum Line Regulation:

.0135 %

Maximum Load Regulation:

.021 %

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Outputs:

3

No. of Terminals:

16

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Voltage-1:

3.06 V

Minimum Output Voltage-1:

2.94 V

Nominal Output Voltage-1:

3 V

Maximum Output Voltage-2:

3.06 V

Minimum Output Voltage-2:

2.94 V

Nominal Output Voltage-2:

3 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Qualification Status:

Not Qualified

Maximum Seated Height:

.9 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Voltage Tolerance:

2 %

Width:

4 mm

Trade Compliance

MIC2215-PPMYML-TR Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.