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MCP79521T-I/MN

Microchip Technology

MCP79521T-I/MN by Microchip Technology

MCP79521T-I/MN by Microchip Tech is a small outline RTC with SPI interface, 3.6V max supply voltage, and 64-word RAM. Ideal for industrial applications requiring precise timekeeping, interrupt capability, and operating temperatures from -40 to 85°C. Its compact design with dual terminals makes it suitable for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,620 parts In-Stock

1+ parts

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6,620

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 3,181 parts In-Stock

1+ parts

$1.170

100+ parts

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3,181

$1.170

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Semicontronic

India . 2,942 parts In-Stock

1+ parts

$1.260

100+ parts

$1.228

1k+ parts

$1.222

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2,942

$1.260

$1.228

$1.222

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Ampacity Inc.

Singapore . 2,874 parts In-Stock

1+ parts

$2.740

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2,874

$2.740

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AZTECH Wire

Italy . 1,196 parts In-Stock

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$10.740

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1,196

$10.740

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Aztec Data Supply Inc.

USA . 2,509 parts In-Stock

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$55.360

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2,509

$55.360

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Fulton Briggs Corp.

USA . 4,305 parts In-Stock

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4,305

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QUARKTWIN TECHNOLOGY LTD

USA . 3,595 parts In-Stock

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3,595

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Continental Prestige Electronics

USA . 1,481 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Argo Parts USA

USA . 406 parts In-Stock

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406

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Overview

Enhance your products with the MCP79521T-I/MN from Microchip Technology, a top-tier manufacturer renowned for its high-quality timers and real-time clocks. This versatile device offers unparalleled value with interrupt capability, industrial-grade temperature tolerance, and a wide operating voltage range. Ideal for applications requiring precise timing and data management, this small outline package with very thin profile is perfect for space-constrained designs. Upgrade your projects today with the MCP79521T-I/MN and experience the benefits of reliable performance and unmatched accuracy.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Information Access Method: SERIAL(SPI)

Serial access allows for efficient communication with other devices, enhancing flexibility and integration capabilities.

Surface Mount: YES

Surface mount technology enables easy and secure installation on circuit boards.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power supply options.

On Chip Data RAM Width: 8

A wide data RAM width allows for storage of more data, enhancing the functionality of the product.

Screening Level: TS 16949

Compliance with screening level TS 16949 ensures high quality and reliability.

Package Shape: SQUARE

A square package shape offers efficient use of space on the circuit board.

No. of Terminals: 10

Having 10 terminals allows for versatile connections and integration with other components.

Interrupt Capability: Y

Interrupt capability enables the product to respond promptly to external events or signals.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style optimizes heat dissipation and space utilization in the overall design.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for operation in low-power environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal position facilitates easy and secure connections with other components.

Maximum Seated Height: 0.8 mm

The low maximum seated height allows for a compact and space-saving design.

RAM Words: 64

A large RAM capacity of 64 words enables extensive data storage and processing capabilities.

Width: 3 mm

The small width dimension contributes to a compact overall product size.

Maximum Clock Frequency: 0.032 MHz

A high maximum clock frequency of 0.032 MHz allows for fast and accurate timing functions.

Length: 3 mm

The small length dimension contributes to a space-efficient design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh industrial environments.

Peripheral IC Type: TIMER, REAL TIME CLOCK

This product combines timer and real-time clock functions in a single integrated circuit, providing versatile timekeeping capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance and reliability.

Terminal Form: NO LEAD

No-lead terminal form improves solder joint reliability and thermal performance.

Maximum Supply Current: 5 mA

Low maximum supply current ensures energy-efficient operation.

Minimum Time: 1/100 SECOND

The ability to measure time accurately up to 1/100 second allows for precise timing applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V ensures compatibility with standard power sources.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density mounting on circuit boards.

Technical Specifications

Timers & Real-Time Clocks MCP79521T-I/MN attributes and parameters. Explore more Timers & Real-Time Clocks devices from Microchip Technology

Specs

Additional Features:

ALSO OPEARTES AT 1.8V MIN SUPPLY AT 3MHZ CLOCK FREQ

Maximum Clock Frequency:

.032 MHz

External Data Bus Width:

0

Information Access Method:

SERIAL(SPI)

Interrupt Capability:

Y

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e3

Length:

3 mm

No. of Terminals:

10

No. of Timers:

1

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

64

Screening Level:

TS 16949

Maximum Seated Height:

.8 mm

Maximum Supply Current:

5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Minimum Time:

1/100 SECOND

Volatile:

NO

Width:

3 mm

Peripheral IC Type:

Trade Compliance

MCP79521T-I/MN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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