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MCP7940NT-E/MSVAO

Microchip Technology

MCP7940NT-E/MSVAO by Microchip Technology

MCP7940NT-E/MSVAO by Microchip is a CMOS TIMER & REAL TIME CLOCK with I2C access, 64 RAM words, and interrupt capability. It operates b/w -40 to 125 °C for various applications like automotive systems due to AEC-Q100 screening level and small form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,681 parts In-Stock

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9,681

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 9,855 parts In-Stock

1+ parts

$0.780

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9,855

$0.780

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Semicontronic

India . 9,835 parts In-Stock

1+ parts

$0.780

100+ parts

$0.760

1k+ parts

$0.757

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9,835

$0.780

$0.760

$0.757

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Corohmni

South Africa . 1,017 parts In-Stock

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$16.450

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1,017

$16.450

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$28.310

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$26.894

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$26.894

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500

$28.310

$26.894

$26.894

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Aztec Data Supply Inc.

USA . 2,819 parts In-Stock

1+ parts

$53.670

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2,819

$53.670

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NIA Electronics

USA . 8,209 parts In-Stock

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8,209

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Ledger Components

France . 8,209 parts In-Stock

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LOOK Integrated Logistics

Peru . 6,085 parts In-Stock

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Continental Prestige Electronics

USA . 5,613 parts In-Stock

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LMD Electronica

Estonia . 5,579 parts In-Stock

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Montano Global Distributors

Canada . 3,961 parts In-Stock

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Argo Parts USA

USA . 3,116 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Enhance your timekeeping precision with the MCP7940NT-E/MSVAO by Microchip Technology. This high-quality Timer & Real-Time Clock offers reliability and accuracy for a wide range of applications. With its advanced features and easy-to-use interface, this product provides value and convenience to customers seeking optimal time management solutions. Trust in Microchip's reputation for excellence and elevate your projects with the MCP7940NT-E/MSVAO.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and lightweight design, making it suitable for various applications.

Information Access Method: I2C

I2C communication protocol allows for easy integration with other devices, enabling seamless data transfer.

Surface Mount: YES

Surface mount design allows for easy and secure installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Ability to operate at a high supply voltage provides flexibility and compatibility with different systems.

On Chip Data RAM Width: 8

8-bit data RAM width enhances data processing capabilities and memory storage for efficient operation.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high reliability and quality, making it suitable for automotive applications.

Package Shape: SQUARE

Square package shape offers a compact and space-saving form factor, ideal for constrained designs.

No. of Terminals: 8

8 terminals provide sufficient connectivity options for interfacing with external components and peripherals.

Interrupt Capability: Y

Interrupt capability allows for timely notifications and event handling, improving overall system responsiveness.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline, thin profile, and shrink pitch package style enhances portability and integration in compact devices.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage requirement enables energy-efficient operation and extends battery life.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures reliability and performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range capability allows for operation in extreme cold environments, suitable for outdoor applications.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and facilitates secure connection for reliable performance.

Maximum Seated Height: 1.1 mm

Low maximum seated height minimizes overall profile and allows for slim and compact device designs.

RAM Words: 64

64 RAM words provide ample data storage capacity for storing various settings, timestamps, and system parameters.

Width: 3 mm

Compact 3mm width contributes to a space-efficient design and enables placement in tight spaces on the PCB.

Maximum Clock Frequency: 0.032768 MHz

High maximum clock frequency facilitates precise timekeeping and synchronization for accurate operation.

Length: 3 mm

3mm length complements the compact width and offers a uniform and streamlined package footprint.

Peripheral IC Type: TIMER, REAL TIME CLOCK

Combination of timer and real-time clock functionality enhances timekeeping accuracy and utility for various applications.

Technology: CMOS

CMOS technology ensures low power consumption, high noise immunity, and reliable performance for long-term operation.

Terminal Form: GULL WING

Gull wing terminal form provides robust mechanical support and secure solder connections for durability and stability.

Minimum Time: SECONDS

Support for timekeeping in seconds allows for precise tracking and synchronization of events and operations.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5V ensures consistent and reliable performance under varying operating conditions.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm enables high-density mounting on the PCB, optimizing space utilization and layout efficiency.

Technical Specifications

Timers & Real-Time Clocks MCP7940NT-E/MSVAO attributes and parameters. Explore more Timers & Real-Time Clocks devices from Microchip Technology

Specs

Maximum Clock Frequency:

.032768 MHz

External Data Bus Width:

0

Information Access Method:

I2C

Interrupt Capability:

Y

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Terminals:

8

No. of Timers:

1

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

RAM Words:

64

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Minimum Time:

SECONDS

Volatile:

NO

Width:

3 mm

Peripheral IC Type:

Trade Compliance

MCP7940NT-E/MSVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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