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MCP73862-I/SL

Microchip Technology

MCP73862-I/SL by Microchip Technology

MCP73862-I/SL by Microchip Technology is a power management IC with a small outline package style. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 12V. This IC is commonly used as a power supply support circuit in industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,315 parts In-Stock

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4,315

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LWI Electronics Inc

India . 195 parts In-Stock

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195

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Nova Conductors

Japan . 55 parts In-Stock

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55

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$2.234

100+ parts

$2.056

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$1.926

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1,000

$2.234

$2.056

$1.926

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Corohmni

South Africa . 69 parts In-Stock

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$3.300

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69

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Ampacity Inc.

Singapore . 216 parts In-Stock

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$3.500

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216

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Semicontronic

India . 373 parts In-Stock

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$6.500

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$6.338

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$6.305

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373

$6.500

$6.338

$6.305

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Aztec Data Supply Inc.

USA . 2,869 parts In-Stock

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$8.495

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$8.495

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AZTECH Wire

Italy . 729 parts In-Stock

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$11.767

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West Coast Incorporated

USA . 6,627 parts In-Stock

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6,627

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Continental Prestige Electronics

USA . 4,070 parts In-Stock

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Vigor

Singapore . 3,696 parts In-Stock

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Argo Parts USA

USA . 1,971 parts In-Stock

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Microchip USA

USA . 198 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Discover the MCP73862-I/SL, a high-quality power management IC by Microchip Technology. Trusted by professionals and industry leaders, Microchip Technology delivers reliable and innovative solutions. The MCP73862-I/SL is perfect for various applications in power management, offering exceptional value and benefits to customers. With its compact design and advanced features, this small outline package provides efficient power supply support without compromising on performance. Experience the advantages of the MCP73862-I/SL and unlock a world of possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and helps in keeping the IC cool during operation, increasing its reliability.

Surface Mount: YES

Surface mount type makes it easy to assemble onto PCBs, saving time and effort in production.

Power Supplies (V): 4.5/12

Supports a wide range of power supplies, making it versatile for different applications.

No. of Terminals: 16

Provides multiple connection points for flexibility in circuit design.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperatures, making it suitable for harsh environments.

Width (mm): 3.9 mm

Compact size allows for space-saving on PCBs.

No. of Channels: 2

Supports multiple channels for handling different power requirements efficiently.

Technical Specifications

Power Management ICs MCP73862-I/SL attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

8.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

MCP73862-I/SL Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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