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MCP73837-FJI/MF

Microchip Technology

MCP73837-FJI/MF by Microchip Technology

MCP73837-FJI/MF by Microchip is a Power Management IC with 10 terminals, operating b/w -40 to 85 °C. It has a nominal voltage of 5.2V and supports industrial temperature grade applications. The IC features adjustable threshold voltage, matte tin terminal finish, and small outline package style for power supply support circuits.

Median Price

$1.510

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 360 parts In-Stock

1+ parts

$1.510

100+ parts

$1.260

1k+ parts

$1.140

10k+ parts

-

360

$1.510

$1.260

$1.140

-

DigiKey

USA . 145 parts In-Stock

1+ parts

$1.510

100+ parts

$1.140

1k+ parts

-

10k+ parts

-

145

$1.510

$1.140

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$1.131

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$1.131

-

-

-

Vyrian

USA . 6,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,856

-

-

-

-

Cyclops Electronics Ltd

UK . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,898 parts In-Stock

1+ parts

$1.280

100+ parts

-

1k+ parts

-

10k+ parts

-

1,898

$1.280

-

-

-

West Coast Incorporated

USA . 6,166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,166

-

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$1.109

1k+ parts

$1.075

10k+ parts

$1.052

500

-

$1.109

$1.075

$1.052

Perfect Parts

USA . 76 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

76

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-

Overview

Discover the Microchip Technology MCP73837-FJI/MF, a high-quality Power Management IC that offers unparalleled reliability and performance. With Microchip Technology's reputation for excellence in manufacturing, this product is trusted by industry professionals worldwide. Ideal for various applications in power supply support circuits, this IC boasts a small outline, very thin profile package style, making it versatile and easy to integrate into your design. Experience the benefits of adjustable threshold voltage, industrial-grade temperature tolerance, and matte tin terminal finish. Enhance your projects with the MCP73837-FJI/MF and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making the product suitable for industrial applications.

Surface Mount: YES

Allows for easy installation and space-saving on the PCB.

Nominal Supply Voltage (Vsup): 5.2 V

Provides a stable power source for connected devices.

No. of Terminals: 10

Offers flexibility in connecting various components.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Can operate in very low temperatures, making it suitable for a wide range of environments.

Peak Reflow Temperature °C: 260

Capable of withstanding high-temperature soldering processes.

Nominal Threshold Voltage (V): +4.2V

Provides a precise threshold for power supply management.

Temperature Grade: INDUSTRIAL

Designed to meet the rigorous demands of industrial applications.

Maximum Supply Current (Isup): 3 mA

Efficient power management with low power consumption.

Technical Specifications

Power Management ICs MCP73837-FJI/MF attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

3 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.2V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3 mm

Trade Compliance

MCP73837-FJI/MF Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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