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MCP73113T-06SI/MF

Microchip Technology

MCP73113T-06SI/MF by Microchip Technology

MCP73113T-06SI/MF by Microchip Technology is a Power Management IC with 10 terminals, Vsup of 5V, and adjustable threshold at +4.2V. It is a small outline package suitable for industrial applications like power supply support circuits due to its wide operating temperature range from -40°C to 85°C.

Median Price

$1.510

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,253 parts In-Stock

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$1.510

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3,253

$1.510

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DigiKey

USA . 3,177 parts In-Stock

1+ parts

$1.510

100+ parts

$1.140

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-

10k+ parts

$1.140

3,177

$1.510

$1.140

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$1.140

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,623 parts In-Stock

1+ parts

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2,623

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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Corohmni

South Africa . 113 parts In-Stock

1+ parts

$1.086

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113

$1.086

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Ampacity Inc.

Singapore . 1,438 parts In-Stock

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$1.280

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1,438

$1.280

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Semicontronic

India . 1,447 parts In-Stock

1+ parts

$2.790

100+ parts

$2.720

1k+ parts

$2.706

10k+ parts

-

1,447

$2.790

$2.720

$2.706

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Aztec Data Supply Inc.

USA . 608 parts In-Stock

1+ parts

$13.872

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608

$13.872

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Kepictronics

USA . 30,279 parts In-Stock

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30,279

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Lixinc

USA . 13,047 parts In-Stock

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13,047

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 3,058 parts In-Stock

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3,058

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Continental Prestige Electronics

USA . 3,058 parts In-Stock

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3,058

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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West Coast Incorporated

USA . 1,649 parts In-Stock

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1,649

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Overview

Discover the innovative MCP73113T-06SI/MF by Microchip Technology, a top-quality Power Management IC designed to optimize performance and efficiency in various applications. With a focus on excellence, Microchip Technology ensures reliability and precision in every product. This versatile IC offers customers a seamless experience with its advanced features and benefits, making it an ideal choice for power supply support circuits. Embrace the future of technology with the MCP73113T-06SI/MF and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making it a good choice for long-term use.

Surface Mount: YES

Easy to install and saves space on the PCB, making it convenient for compact designs.

Screening Level: TS 16949

Ensures high quality and reliability, making it suitable for automotive applications.

Nominal Supply Voltage (Vsup): 5.2 V

Provides a stable voltage supply to connected devices, ensuring optimal performance.

Power Supplies (V): 5

Supports multiple power supplies, making it versatile for various applications.

No. of Terminals: 10

Sufficient terminals for connecting multiple components, increasing flexibility in design.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact design with heat sink features for efficient heat dissipation in limited spaces.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

Can operate in extremely low-temperature environments, increasing versatility.

Terminal Finish: Matte Tin (Sn)

Provides a durable finish for reliable connections and longevity.

Terminal Position: DUAL

Enables versatile mounting options for different PCB layouts.

Maximum Seated Height: 1 mm

Low-profile design suitable for compact applications.

Width (mm): 3 mm

Slim profile saves space and allows for densely populated PCB layouts.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed to support power supply functions, ensuring efficient operation.

Minimum Supply Voltage (Vsup): 4 V

Can function efficiently even with lower supply voltage, providing flexibility.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperature for a specified duration, ensuring quality soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for reliable solder joints.

Length: 3 mm

Compact length for space-saving designs.

Nominal Threshold Voltage (V): +4.2V

Precise threshold voltage for accurate monitoring and control.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliability.

Maximum Supply Current (Isup): 1.5 mA

Low current consumption for efficient power management.

Terminal Form: NO LEAD

Lead-free terminals for environmentally friendly and RoHS compliant design.

Terminal Pitch: 0.5 mm

Fine pitch spacing for high-density integration on the PCB.

Maximum Supply Voltage (Vsup): 16 V

Supports a wide range of supply voltages, increasing compatibility with different systems.

Adjustable Threshold: YES

Allows for customization of threshold voltage, providing flexibility in applications.

Technical Specifications

Power Management ICs MCP73113T-06SI/MF attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1.5 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

5.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.2V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3 mm

Trade Compliance

MCP73113T-06SI/MF Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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