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MCP6484T-E/ST

Microchip Technology

MCP6484T-E/ST by Microchip Technology

MCP6484T-E/ST by Microchip: 4-function Op Amp with 1500uV max input offset voltage, 89dB CMRR, and 4000kHz unity gain bandwidth. Ideal for automotive applications due to TS16949 screening, low-bias micropower tech, and VFB architecture. Small outline package with thin profile and shrink pitch design.

Median Price

$1.980

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 42 parts In-Stock

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$1.980

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Vyrian

USA . 870 parts In-Stock

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ComSIT Distribution GmbH

Germany . 180 parts In-Stock

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Vigor

Singapore . 1,062 parts In-Stock

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$1.170

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Aztec Data Supply Inc.

USA . 971 parts In-Stock

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$1.800

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971

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Corohmni

South Africa . 1,050 parts In-Stock

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$1.885

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Argo Parts USA

USA . 3,324 parts In-Stock

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Continental Prestige Electronics

USA . 1,588 parts In-Stock

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$1.980

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$1.940

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Netroflash

USA . 100 parts In-Stock

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$1.980

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$1.881

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$1.841

100

$1.980

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$1.881

$1.841

Ampacity Inc.

Singapore . 373 parts In-Stock

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$6.410

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AZTECH Wire

Italy . 523 parts In-Stock

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$9.414

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Microchip USA

USA . 4,800 parts In-Stock

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$9.425

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RGB Technical Solutions

Ukraine . 2,472 parts In-Stock

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Lixinc

USA . 25 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the MCP6484T-E/ST by Microchip Technology. As a leading manufacturer in the industry, Microchip ensures top-notch operational amplifiers that deliver exceptional performance and precision. Ideal for applications requiring high accuracy and low power consumption, this product is a game-changer. With its compact design and advanced features, the MCP6484T-E/ST offers unmatched value and benefits to customers looking for superior electronic components. Trust Microchip Technology for all your operational amplifier needs and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and lightweight.

Maximum Input Offset Voltage: 1500 uV

Low input offset voltage ensures accuracy in signal processing.

Maximum Average Bias Current (IIB): 0.00035 uA

Low bias current helps in minimizing power consumption.

Surface Mount: YES

Surface mount capability allows for easy and compact circuit board design.

Nominal Common Mode Reject Ratio: 89 dB

High common mode rejection ratio helps in rejecting noise and interference.

Nominal Supply Voltage / Vsup (V): 3

Operates efficiently at a nominal supply voltage of 3V.

Maximum Seated Height: 1.2 mm

Low seated height makes it suitable for compact designs.

Nominal Unity Gain Bandwidth: 4000 kHz

High unity gain bandwidth enables high-speed signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier design ensures accurate and stable amplification of signals.

Technical Specifications

Operational Amplifiers (Op Amps) MCP6484T-E/ST attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Microchip Technology

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

4 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

89 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

1500 uV

Minimum Voltage Gain:

56200

Nominal Slew Rate:

2.7 V/us

Peak Bias Current:

350 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

1.6 mA

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Screening Level:

TS 16949

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP14,.25

Trade Compliance

MCP6484T-E/ST Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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