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MCP6061T-E/OTVAO

Microchip Technology

MCP6061T-E/OTVAO by Microchip Technology

MCP6061T-E/OTVAO by Microchip: 150uV Max Input Offset Voltage, 91dB CMRR, 730kHz Unity Gain Bandwidth. Ideal for automotive applications due to AEC-Q100 screening and low bias current of 0.0001uA at -40°C to 125°C operating temperature range.

Median Price

$0.800

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Microchip Technology

USA . 9,000 parts In-Stock

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$0.910

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$0.690

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$0.680

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$0.910

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$0.680

Mouser Electronics

USA . 3,000 parts In-Stock

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$0.690

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$0.690

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NAC Semi

USA . 6,000 parts In-Stock

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$0.940

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$0.850

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$0.780

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$0.940

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$0.780

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Vyrian

USA . 3,942 parts In-Stock

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Nova Conductors

Japan . 83 parts In-Stock

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Ampacity Inc.

Singapore . 1,118 parts In-Stock

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$3.410

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AZTECH Wire

Italy . 348 parts In-Stock

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Marpe Global Electronics

Taiwan . 3,340 parts In-Stock

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Vigor

Singapore . 2,075 parts In-Stock

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Aranea Global

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Microchip USA

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XL Components Corporation

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QualityLine Systems

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Overview

Enhance your electronic designs with the MCP6061T-E/OTVAO operational amplifier by industry leader Microchip Technology. Designed with precision and reliability in mind, this op amp offers unparalleled performance in a compact package. Ideal for automotive applications, this versatile component provides low-offset, micropower operation, and a wide operating temperature range. Trust Microchip Technology to deliver cutting-edge solutions that exceed your expectations. Elevate your projects with the MCP6061T-E/OTVAO and experience superior quality and value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and cost-effective, making the product suitable for a variety of applications.

Maximum Input Offset Voltage: 150 uV

Low input offset voltage ensures high precision and accuracy in signal processing.

Surface Mount: YES

Ease of installation and space-saving design due to surface-mount capability.

Nominal Common Mode Reject Ratio: 91 dB

High common mode rejection ratio helps in reducing unwanted noise and interference in the signal.

Nominal Supply Voltage / Vsup (V): 3

Operates efficiently at a nominal supply voltage of 3V, making it suitable for low-power applications.

Frequency Compensation: YES

Frequency compensation feature ensures stable operation and prevents oscillation issues.

Minimum Voltage Gain: 56200

High minimum voltage gain allows for amplification of weak signals without distortion.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, enhancing the efficiency of the operational amplifier.

Amplifier Type: OPERATIONAL AMPLIFIER

Designed specifically for amplification and signal processing tasks, making it an ideal choice for various electronic circuits.

Temperature Grade: AUTOMOTIVE

Automotive grade ensures reliability and performance in harsh temperature conditions, making it suitable for automotive applications.

Technical Specifications

Operational Amplifiers (Op Amps) MCP6061T-E/OTVAO attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Microchip Technology

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

Yes

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

730 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

91 dB

Minimum Common Mode Rejection Ratio (CMRR ):

74 dB

Input Offset Voltage Limit:

150 uV

Minimum Voltage Gain:

56200

Nominal Slew Rate:

0.25 V/us

Peak Bias Current:

5 nA

Maximum Bias Current (IIB) @25 °C:

100 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

90 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.061 in (1.55 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Screening Level:

AEC-Q100; TS 16949

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

MCP6061T-E/OTVAO Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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