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MCP4716A2T-E/MAY

Microchip Technology

MCP4716A2T-E/MAY by Microchip Technology

MCP4716A2T-E/MAY by Microchip is a 10-bit D/A converter with 0.354% max linearity error. It operates at -40 to 125 °C, consuming 0.4 mA supply current at 3 V. Ideal for automotive applications, it features a small outline package with very thin profile and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,669 parts In-Stock

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Nova Conductors

Japan . 37 parts In-Stock

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Corohmni

South Africa . 488 parts In-Stock

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$1.160

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Ampacity Inc.

Singapore . 883 parts In-Stock

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$17.000

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883

$17.000

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AZTECH Wire

Italy . 243 parts In-Stock

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$17.021

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Aztec Data Supply Inc.

USA . 3,057 parts In-Stock

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$17.360

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Semicontronic

India . 1,365 parts In-Stock

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$26.000

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$25.350

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$25.220

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LOOK Integrated Logistics

Peru . 6,860 parts In-Stock

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LMD Electronica

Estonia . 5,839 parts In-Stock

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Montano Global Distributors

Canada . 4,022 parts In-Stock

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Continental Prestige Electronics

USA . 2,937 parts In-Stock

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Argo Parts USA

USA . 2,235 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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NIA Electronics

USA . 1,284 parts In-Stock

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Ledger Components

France . 1,284 parts In-Stock

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Overview

Upgrade your digital systems with the MCP4716A2T-E/MAY by Microchip Technology. As a leader in the industry, Microchip Technology delivers top-notch quality and reliability in their products. The MCP4716A2T-E/MAY is a Digital-to-Analog Converter that offers unparalleled precision and performance in a compact package. Ideal for automotive applications, this converter provides fast settling times and low linearity error, ensuring optimal functionality in any environment. Experience the value of cutting-edge technology with the MCP4716A2T-E/MAY and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and resistance to heat and chemicals, ensuring the longevity and reliability of the product.

Surface Mount: YES

Surface mount technology allows for easy integration into compact circuit boards, making this converter suitable for space-constrained applications.

No. of Bits: 10

With a higher number of bits, this converter can provide more precise and accurate analog output, making it ideal for applications that require high resolution.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this converter can withstand harsh environmental conditions, making it suitable for automotive and industrial applications.

Nominal Supply Voltage: 3 V

Operating at a low nominal supply voltage, this converter is energy-efficient and can be powered by common battery sources, making it versatile for various applications.

Technical Specifications

Digital-to-Analog Converters MCP4716A2T-E/MAY attributes and parameters. Explore more Digital-to-Analog Converters devices from Microchip Technology

Converter Specifications

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.354 %

Nominal Settling Time (tstl):

6 µs

Maximum Supply Current:

400 μA

No. of Bits:

10

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

40 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

6

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.079 in (2 mm)

Length:

0.079 in (2 mm)

Maximum Seated Height:

0.035 in (0.9 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Equivalence Code:

TSSOP6,.08

Standards and Codes

Screening Level:

TS 16949

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Trade Compliance

MCP4716A2T-E/MAY Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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