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MCP41HV31T-502E/MQ

Microchip Technology

MCP41HV31T-502E/MQ by Microchip Technology

DIGITAL POTENTIOMETER; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 5,399 parts In-Stock

1+ parts

$8.970

100+ parts

-

1k+ parts

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10k+ parts

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5,399

$8.970

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-

NIA Electronics

USA . 5,053 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,053

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Ledger Components

France . 5,053 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,053

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-

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LMD Electronica

Estonia . 2,041 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,041

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LOOK Integrated Logistics

Peru . 1,792 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,792

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Montano Global Distributors

Canada . 1,087 parts In-Stock

1+ parts

-

100+ parts

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1,087

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Technical Specifications

Digital Potentiometers (DigiPOT) MCP41HV31T-502E/MQ attributes and parameters. Explore more Digital Potentiometers (DigiPOT) devices from Microchip Technology

Converter Specifications

Nominal Bandwidth:

480 Hz

Resistance Law:

Linear

Nominal Total Resistance:

100 KΩ

Control Interface:

3-Wire Serial

No. of Functions:

1

Maximum Resistance Tolerance:

20 %

Electrical Characteristics

Nominal Supply Voltage:

3 V

Minimum Resistor Terminal Voltage:

-5 V

Maximum Resistor Terminal Voltage:

18 V

Maximum Supply Current:

300 μA

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Nominal Temperature Coefficient:

100 ppm/°C

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

40 s

Moisture Sensitivity Level (MSL):

1

Form Factor

Terminal Form:

Terminal Position:

Quad

No. of Terminals:

20

Terminal Finish:

Matte Tin

Terminal Pitch:

0.026 in (0.65 mm)

No. of Positions:

256

Maximum Seated Height:

0.039 in (1 mm)

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Packaging

Package Shape:

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Equivalence Code:

LCC20,.20SQ,25

Standards and Codes

Screening Level:

TS 16949

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e3

Trade Compliance

MCP41HV31T-502E/MQ Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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