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MCP3901A0T-I/ML

Microchip Technology

MCP3901A0T-I/ML by Microchip Technology

MCP3901A0T-I/ML by Microchip Technology is a 20-terminal chip carrier with matte tin finish. It operates b/w -40 to 85°C, suitable for industrial applications. With a supply voltage range of 4.5-5.5V, it is ideal for analog circuit designs requiring precise measurements in compact spaces.

Median Price

$2.655

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 16 parts In-Stock

1+ parts

$2.655

100+ parts

-

1k+ parts

-

10k+ parts

-

16

$2.655

-

-

-

Vyrian

USA . 3,404 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,404

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 626 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

-

10k+ parts

-

626

$0.500

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$2.655

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$2.655

-

-

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AZTECH Wire

Italy . 897 parts In-Stock

1+ parts

$10.381

100+ parts

-

1k+ parts

-

10k+ parts

-

897

$10.381

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-

-

RGB Technical Solutions

Ukraine . 23 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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23

-

-

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-

Overview

Experience unparalleled quality and performance with the MCP3901A0T-I/ML by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers cutting-edge solutions for various applications in the semiconductor field. This product offers exceptional value, providing customers with reliable and efficient operation. Whether you're looking to enhance your analog circuit designs or improve system functionality, the MCP3901A0T-I/ML is the perfect choice. Trust Microchip Technology for superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection for the semiconductor components inside.

Surface Mount: YES

Surface mounting capability allows for easier and more efficient assembly onto circuit boards, making it suitable for automated production processes.

Nominal Supply Voltage (Vsup): 5 V

Operates at a standard voltage level of 5V, ensuring compatibility with a wide range of electronic systems.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures up to 85°C, making it suitable for industrial applications where heat resistance is important.

Width (mm): 4 mm

Compact size with a width of 4mm saves space on the circuit board and allows for tighter integration in electronics designs.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5V, this product can still function reliably even under slightly lower voltage conditions.

Peak Reflow Temperature °C: 260

Can withstand high temperatures up to 260°C during the reflow soldering process, ensuring secure and reliable solder joints.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature specifications make this product suitable for harsh operating environments and extended use in demanding conditions.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates that the product has moderate sensitivity to moisture, making it more resilient during storage and handling.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, the product can handle higher voltage inputs without risking damage, providing flexibility in power supply options.

Technical Specifications

Other Function Semiconductors MCP3901A0T-I/ML attributes and parameters. Explore more Other Function Semiconductors devices from Microchip Technology

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

4 mm

Trade Compliance

MCP3901A0T-I/ML Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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