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M83536/10-014M

Microchip Technology

M83536/10-014M by Microchip Technology

POWER/SIGNAL RELAY; Mounting Feature: PANEL MOUNT; Relay Action: MOMENTARY; Relay Function: DPDT; Coil or Input Supply Type: DC; Reference Standard: MIL-PRF-83536/10;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Marpe Global Electronics

Taiwan . 5,824 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,824

-

-

-

-

QualityLine Systems

Poland . 5,824 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,824

-

-

-

-

XL Components Corporation

Australia . 5,824 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,824

-

-

-

-

Technical Specifications

Power & Signal Relays M83536/10-014M attributes and parameters. Explore more Power & Signal Relays devices from Microchip Technology

Relay Characteristics

Relay Type:

Relay Function:

Relay Action:

Relay Form:

2 Form C

Switching Method:

Random

Coil/Input Supply Type:

DC

Contact/Output Supply Type:

AC/DC

Contact Electrical Specifications

Contact Maximum AC Current:

10 A

Contact Maximum AC Voltage:

115 V

Contact Maximum DC Current:

10 A

Contact Maximum AC Rating (R Load):

10A@115VAC

Contact Maximum DC Voltage:

28 V

Contact Maximum DC Rating (R Load):

10A@28VDC

Contact Maximum AC Rating (I Load):

8A@115VAC

Contact Maximum AC Rating (M Load):

4A@115VAC

Coil Electrical Specifications

Coil Power:

2.004 W

Coil Resistance:

72 Ω

Coil Maximum DC Voltage:

12 V

Coil Maximum DC Coil Current:

167 mA

Coil DC Operate Voltage:

6.5 V

Coil DC Release Voltage:

750 mV

Coil Nominal Voltage:

12 V

Physical Specifications

Height:

1.01 in (25.65 mm)

Length/Diameter:

1.025 in (26.03 mm)

Width:

13.34 in (338.836 mm)

Dimensions:

1.025 x 0.525 x 1.01 in (26.03 x 13.34 x 25.65 mm)

Weight:

45.4 g

Mounting Type:

Terminal Count:

8

Terminal Length:

0.2992 in (7.6 mm)

Operational Specifications

Activation Time:

11 ms

Release Time:

11 ms

Minimum Operating Temperature:

-70 °C (-94 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Coil-Contacts Dielectric Strength:

1.25 kVrms

Open Contacts Dielectric Strength:

1.25 kVrms

Insulation Resistance:

100 MΩ

Terminal & Contact Material

Terminal Finish:

Gold

Termination Type:

Solder Hook

Reliability & Standards

Industry Standard Compliance:

JESD-609 Code:

e4

Sealing Type:

Hermetically Sealed

Lifespan:

100000 Cycle(s)

Additional Information

Additional Features:

Transient Suppressed DC Coil

Trade Compliance

M83536/10-014M Relays trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.41.00.20

SB

8536.41.00.20

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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