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KSZ8563RNXV-VAO

Microchip Technology

KSZ8563RNXV-VAO by Microchip Technology

Microchip Technology's KSZ8563RNXV-VAO is an Ethernet switch IC with 64 terminals in a square chip carrier package. Operating temperature ranges from -40 to 105°C, suitable for industrial applications. Nominal voltage is 1.2V, making it ideal for telecom switching systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Microchip Technology

USA . 2,600 parts In-Stock

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2,600

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Vyrian

USA . 2,959 parts In-Stock

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2,959

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Aztec Data Supply Inc.

USA . 918 parts In-Stock

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$6.270

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918

$6.270

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Corohmni

South Africa . 194 parts In-Stock

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$13.269

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194

$13.269

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Ampacity Inc.

Singapore . 2,674 parts In-Stock

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$595.000

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$595.000

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Semicontronic

India . 2,758 parts In-Stock

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$922.000

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$898.950

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$894.340

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2,758

$922.000

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$894.340

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Argo Parts USA

USA . 4,846 parts In-Stock

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Fulton Briggs Corp.

USA . 3,358 parts In-Stock

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3,358

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Continental Prestige Electronics

USA . 1,725 parts In-Stock

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1,725

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Bastille Electronics

Australia . 56 parts In-Stock

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Overview

Unleash the power of seamless connectivity with the KSZ8563RNXV-VAO by Microchip Technology. Crafted with precision and expertise, this Ethernet switch offers unparalleled performance and reliability in the Telecom industry. From its advanced features to its durable package body material, this product is designed to exceed your expectations. Experience fast and efficient networking solutions with the KSZ8563RNXV-VAO, setting a new standard in telecommunications technology. Elevate your connectivity experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to temperature variations, ensuring reliable performance in various operating conditions.

Surface Mount: YES

Facilitates easy and efficient mounting onto circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and quality, making it suitable for automotive applications.

Package Shape: SQUARE

Optimizes space utilization on the circuit board, allowing for compact and efficient design layouts.

No. of Terminals: 64

Offers a sufficient number of connection points for the switching IC to interface with other components, enhancing its functionality.

Maximum Operating Temperature: 105 °C

Ensures stable performance even in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Allows for reliable operation in low-temperature conditions, extending the product's usability in varying climates.

Terminal Position: QUAD

Enables easy and secure soldering of the IC onto the circuit board, ensuring a stable electrical connection.

Maximum Seated Height: 0.9 mm

Provides a low-profile design, allowing for compact and space-saving integration in electronic devices.

Width: 8 mm

Compact width dimension enables flexibility in board placement and design, enhancing overall system layout efficiency.

Length: 8 mm

Compact length dimension enables efficient use of space on the circuit board, contributing to a streamlined device design.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable performance in demanding conditions.

Terminal Form: NO LEAD

Lead-free terminal configuration complies with environmental regulations and provides a more sustainable solution.

Telecom IC Type: ETHERNET SWITCH

Specifically designed for networking applications, offering advanced features for managing Ethernet connections effectively.

Nominal Supply Voltage: 1.2 V

Low supply voltage requirement helps in reducing power consumption and improving energy efficiency in the system.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting on the circuit board, enabling compact and space-efficient designs.

Technical Specifications

Telecom - Switching ICs KSZ8563RNXV-VAO attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQCC-N64

Length:

8 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.32SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

8 mm

Trade Compliance

KSZ8563RNXV-VAO Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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