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JAN1N752A-1

Microchip Technology

JAN1N752A-1 by Microchip Technology

ZENER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;

Median Price

$1.868

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 424 parts In-Stock

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$1.817

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$1.687

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Microchip Technology

USA . 1,985 parts In-Stock

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$1.920

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Mouser Electronics

USA . 444 parts In-Stock

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$3.840

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$2.830

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$2.050

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$1.980

444

$3.840

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$1.980

Verical

USA . 424 parts In-Stock

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$1.687

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TEDSS.com

USA . 69 parts In-Stock

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$2.020

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Freelance Electronics

USA . 3,835 parts In-Stock

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$2.875

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$3.019

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$2.847

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$2.875

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$2.847

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American Microsemiconductor Inc.

USA . 1 parts In-Stock

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$24.680

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1

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Legend Electronics Inc.

USA . 1,106 parts In-Stock

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Electronic Expediters

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Resion

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Speed Components Ltd

Israel . 222 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 161 parts In-Stock

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Odi Ramu Company

Canada . 127 parts In-Stock

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LWI Electronics Inc

India . 87 parts In-Stock

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R&J Components

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North Shore Components

USA . 48 parts In-Stock

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QIE Inc.

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South Electronics

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PAR Electronics

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 372 parts In-Stock

1+ parts

$1.870

100+ parts

$1.730

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QUARKTWIN TECHNOLOGY LTD

USA . 18,399 parts In-Stock

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Microchip USA

USA . 8,327 parts In-Stock

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Perfect Parts

USA . 2,247 parts In-Stock

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West Coast Incorporated

USA . 736 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 3 parts In-Stock

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Technical Specifications

Zener Diodes JAN1N752A-1 attributes and parameters. Explore more Zener Diodes devices from Microchip Technology

Specs

Additional Features:

METALLURGICALLY BONDED

Case Connection:

ISOLATED

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

JEDEC-95 Code:

DO-35

JESD-30 Code:

O-LALF-W2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

GLASS

Package Shape:

Package Style (Meter):

LONG FORM

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.5 W

Qualification:

Qualified

Reference Standard:

MIL-19500/127

Nominal Reference Voltage:

5.6 V

Surface Mount:

NO

Technology:

ZENER

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

Maximum Voltage Tolerance:

5 %

Working Test Current:

20 mA

Trade Compliance

JAN1N752A-1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

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